H8DCT-F
Supermicro, Inc.

   
  A+ Products   Motherboards   [ H8DCT-F ]
Supermicro Aplus Motherboard H8DGT-F

Key Features
1. Dual AMD Opteron™ 4000 series
    processors (Socket C32)
    8/6/4-Core ready; HT3.0 Link support
2. AMD SR5670 + SP5100 Chipset
3. Up to 192GB DDR3 1600MHz ECC
    Registered DIMM; 12x DIMM sockets
4. Intel® 82576 controller,
    Dual-Port Gigabit Ethernet
5. 4x SATA (3.0 Gbps) ports via
    AMD SP5100 controller, RAID 0, 1, 10
6. Expansion slot:
    1 PCI-E 2.0 x16
7. Support IPMI 2.0 with dedicated LAN

 
Links & Resources
Tested Memory List
Tested HDD List
Motherboard Manual
Update Your BIOS
IPMI Firmware
Download the Latest Drivers and Utilities
Download Driver CD
OS Compatibility

   

Product SKUs - Discontinued SKU (EOL). Please contact sales-rep for alternative options.
MBD-H8DCT-F
  • H8DCT-F (Standard Retail Pack)
 
Physical Stats
Form Factor
  • Proprietary Form
Dimensions
  • 6.5" x 16.64" (16.4cm x 42.3cm)
 
Processor/Chipset
CPU
  • Dual 1207-pin Socket C32
  • Supports two 8/6/4-Core ready AMD Opteron™ 4000 Series processors
  • HT3.0 Link support
Chipset
  • AMD chipset SR5670 + SP5100
 
System Memory
Memory Capacity
  • 12 DIMM sockets
  • Supports up to 192GB Registered ECC or 64GB Unbuffered ECC/non-ECC DDR3 1600/1333/1066 SDRAM in 12 DIMMs
  • Dual channel memory bus
  • For Dual CPUs: Recommended that memory be populated equally in adjacent memory banks
  • See Detailed Memory Support Matrix
Memory Type
  • DDR3 1600/1333/1066 MHz Registered ECC or Unbuffered ECC/non-ECC SDRAM 72-bit, 240-pin gold-plated DIMMs
DIMM Sizes
  • 1GB, 2GB, 4GB, 8GB, 16GB, 32GB
Memory Voltage
  • 1.35V or 1.5V
 
On-Board Devices
SATA
  • AMD SP5100 (RAID 0, 1, 10)
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM over LAN support
  • Winbond® WPCM450 BMC
Network Controllers
  • Intel® 82576 controller, Dual-Port
      Gigabit Ethernet
  • 10/100/1000BASE-T support
VGA
  • Matrox G200eW 16MB DDR2
Super I/O
  • Winbond® W83527 chip
 
Input / Output
SATA
  • 4x SATA (3Gb/s) ports
LAN
  • 2 RJ45 LAN ports
  • 1 RJ45 Dedicated LAN supports IPMI
USB
  • 4x USB 2.0 ports
  • 2x Rear, 1x header (2 ports)
VGA
  • 1x VGA port
Serial Ports
  • 1x Fast UART 16550 serial port
Others
  • TPM header
 
Expansion Slots
PCI-E
  • 1 PCI-E 2.0 x16
Recommended Chassis
1U Twin
  • SC808, SC809
 
System BIOS
BIOS Type
  • 16Mb SPI Flash ROM with AMI® BIOS
BIOS Features
  • Plug and Play (PnP)
  • DMI 2.3
  • PCI 2.2
  • ACPI 2.0
  • USB Keyboard Support
  • SMBIOS 2.3
 
Management
Software
Power Configurations
  • ACPI Power Management
  • Keyboard Wakeup from Soft-Off
  • Power-on mode control for AC power loss recovery
 
PC Health Monitoring
CPU
  • Monitors CPU Core Voltages, +1.8V, +3.3V, +5V, +12V, +3.3V Standby, VBAT, HT, memory, chipset
  • CPU switching voltage regulator
FAN
  • Up to 3-fan status tachometer monitoring
  • Up to three 4-pin fan headers
  • Status monitor for speed control
  • 3-pin fan support (w/o speed control)
  • Low noise fan speed control
     (4-pin fan only)
  • Pulse Width Modulated (PWM) fan connectors
Temperature
  • Monitoring for CPU and chassis environment
  • CPU Thermal Trip Support
  • Thermal control for 8x Fan connectors
  • I2C Temperature Sensing Logic
LED
  • CPU / System Overheat LED
  • +5V Standby Alert LED
 
Operating Environment / Compliance
RoHS

RoHS 5/6
Environmental Specifications
  • Operating Temperature:
       10°C to 35°C (50°F to 95°F)
  • Non-operating Temperature:
       -40°C to 70°C (-40°F to 158°F)
  • Operating Relative Humidity:
       8% to 90% (non-condensing)
  • Non-operating Relative Humidity:
       5% to 95% (non-condensing)
 
OS Compatibility
• Please see our OS Compatibility Chart
 
Regulatory
FCC
  • Passed to meet FCC standard requirement
Retail Pack List
  Part Number Qty Description
H8DCT-F MBD-H8DCT-F -O 1 H8DCT-F Motherboard
I/O Cable 1 CBL-0228L 2 55CM SATA ROUND S-RA PBF
Information in this document is subject to change without notice.
Other products and companies referred to herein are trademarks or registered trademarks of their respective companies or mark holders.
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