Supermicro Expands End-to-End DCBBS Liquid Cooling Portfolio with Rear Door Heat Exchangers for High-Density AI and HPC Infrastructure
- Expanded ten-model portfolio supports cooling chill door capacities from 10kW up to 120kW for systems level to rack-scale AI factories
- Flexible Rear Door Heat Exchangers deliver rapid, low-disruption liquid cooling for both new and legacy data centers
- Integrated DCBBS deliver validated rack-scale infrastructure, intelligent management software, and global deployment services
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Supermicro Simplifies Edge AI Deployments with Validated Kubernetes Appliances with Red Hat and Everpure
SAN JOSE, Calif., July 8, 2026 — Super Micro Computer, Inc. (NASDAQ: SMCI), an AI, Enterprise, Storage, and 5G/Edge Total IT Solution Provider featuring Data Center Building Block Solutions® (DCBBS), today announced the launch of Kubernetes Edge AI appliances in collaboration with Red Hat and Everpure.
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Taiwan Business Update
Dear Valued Customers and Partners, I am reaching out regarding this week’s events in Taiwan and recent media coverage about shipments of Supermicro products. We deeply value the trust you place in us to meet your AI, cloud, and enterprise infrastructure needs, and believe it is important that you hear directly from me.
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Taking an Up-Close Look at the Supermicro GB300 Super AI Station
With NVIDIA announcing multiple new desktop system designs at Computex 2026, NVIDIA’s partners were understandably eager to show off their current and forthcoming wares.
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What Supermicro's New Edge Systems Mean for Data Centres
Mory Lin discusses how Supermicro's new Intel-powered edge systems enable AI inferencing at the edge, connecting workloads to core data centres
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MWC Shanghai 2026
Shanghai, China (#N1.D110)
Jun 24 - Jun 26, 2026
Jun 24 - Jun 26, 2026
Join us for MWC Shanghai 2026 this June
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Supermicro Broadens AI at the Edge Solutions Portfolio with Intel-Powered Platforms Optimized for Low-Latency Inference and Industrial Deployments
- Accelerate Edge AI Adoption with Low-Latency, Power-Efficient Systems Optimized for Retail, Manufacturing, Security, and Logistics
- Deploy Larger AI Models at the Edge with Up to 32GB VRAM, Multi-GPU Scalability, and High-Bandwidth Memory Architectures
- Flexible Portfolio Combines Integrated NPUs, Discrete GPU Acceleration, and Compact Form Factors to Reduce TCO and Simplify AI Deployment
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ISC High Performance 2026
Hamburg, Germany
Jun 22 - Jun 26, 2026
Jun 22 - Jun 26, 2026
Join us for ISC High Performance 2026 this June
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Supermicro Delivers NVIDIA Vera Rubin NVL4 End-to-End DCBBS Blueprint with Native FP64 Performance for Converged HPC and AI Infrastructure
- Total solution includes up to 1,152 NVIDIA Rubin GPUs and 576 NVIDIA Vera CPUs in liquid-cooled racks—3.2MW Scalable Unit delivers next-generation performance for AI workloads and FP64 simulation, scalable to research clusters of any size
- DLC-2 Direct Liquid Cooling supports 362 kW per rack with 3x in-row CDUs per Scalable Unit plus cold plates, manifolds, and SMC PG25-A ultra-high electrical impedance coolant
- End-to-end solution accelerates AI and HPC infrastructure buildout for scientific research starting with project planning and site survey, through manufacturing and testing, to on-site deployment
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