Key Features
- Intel® Xeon® W-3400 series, W-2400 series, W-3500 series, W-2500 series processors, Single Socket Socket E (LGA-4677) supported, Up to 60 CPU cores and a thermal design power (TDP) of up to 385W.
- Intel® W790
- Up to 2TB RDIMM 3DS, 512GB ECC RDIMM; DDR5-4800MT/s (1DPC)/4400MT/s (2DPC), in 8 DIMM slots
- 3 PCIe 5.0 x16 Slots, support up to 3 Single-Width, 2 Double-Width, or 2 Triple-Width GPU cards; 1 PCIe 4.0 x4 Slots
- M.2 Interface: 2 PCIe 5.0 x4 (Software RAID 0,1); M.2 Form Factor: 2280/22110; M.2 Key: M-Socket (w/o heat sink)
- 1GbE LAN port with Intel® Ethernet Controller I210-AT10GbE LAN with Marvell AQC113
- 6 SATA 3 (6Gb, RAID 0, 1, 5, 10)
- IPMI Supported
- Overclocking Supported (optional)
Key Features
- 5th/4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP
- Intel C741® Chipset
- Up to 2TB 3DS ECC RDIMM, DDR5-5600MT/s (1DPC) in 8 DIMM slots
- 8 NVMe ports PCIe 5.0 x4 via 4 MCIO connectors
- 1 PCIe 5.0 x8,2 PCIe 5.0 x16,4 PCIe 5.0 x8 MCIO connectorsM.2 Interface: 2 PCIe 4.0 x2M.2 Form Factor: 2280, 22110M.2 Key: M-Key
- Dual LAN with 10GBase-T with Intel® X550
- 5 USB 3.2 Gen1 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers)
- Intel® C741 controller for 10 SATA3 (6 Gbps) ports or 2 PCIe 3.0 x4 NVMe + 2 SATA3 ports; RAID (SATA) 0,1,5,10
Key Features
- 5th/4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP
- Intel C741® Chipset
- Up to 2TB 3DS ECC RDIMM, DDR5-5600MT/s (1DPC) in 8 DIMM slots
- 8 NVMe ports PCIe 5.0 x4 via 4 MCIO connectors
- 1 PCIe 5.0 x8,2 PCIe 5.0 x16,4 PCIe 5.0 x8 MCIO connectors M.2 Interface: 2 PCIe 4.0 x2M.2 Form Factor: 2280, 22110M.2 Key: M-Key
- Dual LAN with 1GbE with Intel® I350
- 5 USB 3.2 Gen1 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers)
- Intel® C741 controller for 10 SATA3 (6 Gbps) ports or 2 PCIe 3.0 x4 NVMe + 2 SATA3 ports; RAID (SATA) 0,1,5,10
