Product Naming Convention - Servers (AMD)

AS -21st02nd23rd24th(T)(5th)G6th-B7thT8thR9thF10th
Example product name: AS -2022TG-BTRF

Character Representation Options
1st Form Factor         • 1 = 1U
        • 2 = 2U
        • 3 = 3U
        • 4 = 4U / Tower or Mid-Tower
2nd HD Tray Type         • 0 = 3.5"
        • 1 = 2.5"
3rd CPU         • 1 = Single CPU
        • 2 = Dual CPU
        • 4 = Quad CPU
4th Generation         • 0 = 1st Generation (Opteron 940)
        • 1 = 2nd Generation (Socket F/AM2)
        • 2 = 3rd Generation (Socket G34, C32, AM3+)
5th Server Platform         • T = Twin Server
        • G = GPU
        • M = MicroCloud
6th MB Platform / Chipset         • A = AMD Chipset (Socket F/AM2+/AM3+)
        • C = Socket C32 Board
        • G = Socket G34 Board
        • S = Serverworks Chipset
        • M = nVidia MCP55 Pro Chipset
7th/8th Interface Type         • 2 = DDR2
        • 3 = SAS
        • 6 = SAS2
        • 8 = SCSI
        • T = SATA
        • I = IDE
        • U = UIO
        • N = N:Neutral (2 std. PCIe & SATA
        • L = Cost-Effective Solution
        • H(B) = (Twin hot-plug)
        • H(D) = Dual node twin hot-plug
        • M(R/F) = Short depth < 15" chassis rear
                          (R=Rear/F=Front I/O)
        • IBQ(IBX)= InfiniBand QDR (DDR)
        • 70 = Broadcom 2008
        • 71 = Broadcom 2108
        • 72 = Broadcom 2208
        • 73 = Broadcom 2308
        • 12 = 12 Nodes
9th and higher Power Redundancy / IPMI         • 4 = Quad LAN
        • F = IPMI (Intelligent Platform Management Interface)
        • R = Redundant Power
        • + = Max Memory Support Enabled
                 (12 or up per CPU Socket)
        • B = Black Chassis (only at last place)