Product Naming Convention - Servers (AMD)
AS -2022(T)G-BTRF
Character | Representation | Options |
1st | Form Factor |
• 1 = 1U • 2 = 2U • 3 = 3U • 4 = 4U / Tower or Mid-Tower |
2nd | HD Tray Type |
• 0 = 3.5" • 1 = 2.5" |
3rd | CPU |
• 1 = Single CPU • 2 = Dual CPU • 4 = Quad CPU |
4th | Generation |
• 0 = 1st Generation (Opteron 940) • 1 = 2nd Generation (Socket F/AM2) • 2 = 3rd Generation (Socket G34, C32, AM3+) |
5th | Server Platform |
• T = Twin Server • G = GPU • M = MicroCloud |
6th | MB Platform / Chipset |
• A = AMD Chipset (Socket F/AM2+/AM3+) • C = Socket C32 Board • G = Socket G34 Board • S = Serverworks Chipset • M = nVidia MCP55 Pro Chipset |
7th/8th | Interface Type |
• 2 = DDR2 • 3 = SAS • 6 = SAS2 • 8 = SCSI • T = SATA • I = IDE • U = UIO • N = N:Neutral (2 std. PCIe & SATA • L = Cost-Effective Solution • H(B) = (Twin hot-plug) • H(D) = Dual node twin hot-plug • M(R/F) = Short depth < 15" chassis rear (R=Rear/F=Front I/O) • IBQ(IBX)= InfiniBand QDR (DDR) • 70 = Broadcom 2008 • 71 = Broadcom 2108 • 72 = Broadcom 2208 • 73 = Broadcom 2308 • 12 = 12 Nodes |
9th and higher | Power Redundancy / IPMI |
• 4 = Quad LAN • F = IPMI (Intelligent Platform Management Interface) • R = Redundant Power • + = Max Memory Support Enabled (12 or up per CPU Socket) • B = Black Chassis (only at last place) |