X13SEI-F

X13SEI-F
X13 UP Mainstream Server Board

Key Features


  1. 5th/4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E), CPU TDP supports up to 350W TDP
  2. Intel C741® Chipset
  3. Up to 2TB 3DS ECC RDIMM, DDR5-5600MT/s (1DPC) in 8 DIMM slots
  4. 2 MCIO (PCIe5.0 x8) connectors for 4 NVMe SSDs
  5. 2 PCIe 5.0 x16; 3 PCIe 5.0 x8
  6. M.2 Interface: 2 PCIe 5.0 x4 (Form Factor: 2280/22110, M-Key)
  7. Dual LAN with 1GbE with Intel® I210
  8. 4 USB 3.2 Gen1 (2 rear, 1 Type-A, 1 via header), 2 USB 2.0 (2 rear)
  9. Intel® C741 controller for 10 SATA3 (6 Gbps) ports
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Specifications Resources Parts List
Specifications
Product SKUs
MBD-X13SEI-F
Physical Stats
Form Factor
  • E-ATX
Dimension
  • 12.3" x 10.1" (31.24cm x 25.65cm)
Processor
CPU
Core Count
  • Up to 64C
Note
  • Supports up to 350W TDP CPUs
System Memory
Memory
  • Slot Count: 8 DIMM Slots
DIMM Sizes
  • RDIMM:16GB, 24GB, 32GB, 48GB, 64GB, 96GB, 128GB
  • 3DS RDIMM:128GB, 256GB
Error Detection
  • Corrects single-bit errors
  • Detects double-bit errors (using ECC memory)
On-Board Devices
Chipset
  • Intel® C741
SATA
  • 10 SATA (6Gbps) via Intel® C741; RAID 0/1/5/10 support
IPMI
  • ASPEED AST2600 BMC
Network Controller
  • Dual LAN with 1GbE with Intel® I210
Input / Output
LAN
  • 2 RJ45 1 GbE LAN port(s)
  • 1 RJ45 1 GbE Dedicated IPMI LAN port(s)
USB
  • 2 USB 2.0 port(s) (rear)
  • 2 USB 3.2 Gen1 port(s) (Rear)
  • 1 USB 3.2 Gen1 Type-A port(s)
  • 1 USB 3.2 Gen1 port(s) (Header)
Video
  • 1 Aspeed AST2600 BMC port(s)
  • 1 VGA D-Sub Connector port(s)
Serial
  • 1 COM port(s) (header)
DOM
  • 2 SATA DOM (Disk on Module) port(s) with power connector support
TPM
  • 1 TPM 2.0 Header
Expansion Slots
PCI-Express (PCIe) Configuration
  • 2 PCIe 5.0 x16 slots
  • 3 PCIe 5.0 x8 slots
  • 2 PCIe 5.0 x8 via MCIO Connector slots
M2
  • 2 M.2 PCIe 5.0 x4 slots (M-key 2280/22110)
System BIOS
BIOS Type
  • AMI UEFI
BIOS Features
  • ACPI 6.4
  • SMBIOS 3.5
  • UEFI 2.8 or above
Management
Software
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
PC Health Monitoring
Voltage
  • +12V,+3.3V,+5V,+5V standby,7-fan status,Chassis intrusion header,Chipset voltage,Memory Voltages,Monitors CPU voltages,Supports system management utility,System level control,VBAT
LED
  • CPU/system overheat LED
  • UID/remote UID LED
Temperature
  • CPU thermal trip support
  • Monitoring for CPU and chassis environment
  • PECI
  • Thermal monitor 2 (TM2) support
FAN
  • 7x 4-pin fan headers (up to 7 fans)
  • 7 fans with tachometer status monitoring
  • Fan speed control
  • Overheat LED indication
Other Features
  • ACPI power management
  • Chassis intrusion detection
  • Control of power-on for recovery from AC power loss
  • M.2 NGFF connector
  • Node manager support
  • UID
  • WOL
Operating Environment
Environmental Spec.
  • Operating Temperature: -5°C to 55°C (23°F to 131°F )
  • Non-operating Temperature: -30°C to 60°C (-22°F to 140°F)
  • Operating Relative Humidity: 8% to 80%
  • Non-operating Relative Humidity: 8% to 90%
Resources
Chassis
SC743TQ-903B-SQ
(Heatsink1 :SNK-P0090AP4 )
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  1. = Optimized SuperServer Chassis
  2. = Optimized Global Chassis
  3. Blue color = Compatible Chassis
  4. = Compatible Global Chassis
Component Options
Liste des unités centrales
Liste des AOC testés
Liste des disques durs / disques SSD testés
Liste M.2 testée
Liste des mémoires testées
Software
Firmware BMC
Télécharger le CD de pilotes
Télécharger les derniers pilotes et utilitaires
Compatibilité avec les systèmes d'exploitation
Mise à jour du BIOS
Documentation
Manuel de la carte mère
Guide de référence rapide
Parts List
Standard Parts (Bulk Package)
Part Number Qty Description
CPU carrier SKT-1333L-0000-FXC 1 CPU carrier for 4th Gen Intel® Xeon® Scalable processors (XCC)
SKT-1424L-001B-FXC 1 CPU carrier for 4th Gen Intel® Xeon® Scalable processors (MCC)
I/O Shield MCP-260-00042-1N 1 STD I/O Shield for X13SEI-TF/-F with EMI Gasket
SATA cable CBL-0044L • 2 57.5 cm SATA FLAT S-S PBF
Standard Parts (Retail Package)
Part Number Qty Description
CPU carrier SKT-1333L-0000-FXC 1 CPU carrier for 4th Gen Intel® Xeon® Scalable processors (XCC)
SKT-1424L-001B-FXC 1 CPU carrier for 4th Gen Intel® Xeon® Scalable processors (MCC)
I/O Shield MCP-260-00042-1N 1 STD I/O Shield for X13SEI-TF/-F with EMI Gasket
QRG MNL-2450-QRG 1 Quick Reference Guide
SATA cable CBL-0044L • 2 57.5 cm SATA FLAT S-S PBF
Optional Parts
Part Number Qty Description
Active Heatsink SNK-P0088AP4 • 1 Active CPU Heatsink for 2U chassis
SNK-P0090AP4 • 1 Active CPU Heatsink for 4U chassis
Passive heatsink SNK-P0087P • 1 Passive CPU Heatsink for 1U chassis
SNK-P0088P • 1 Passive CPU Heatsink for 2U chassis
TPM security module AOM-TPM-9670V 1 SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor

X13SEI-F

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