SuperServer SYS-211SE-31A

X13 SuperEdge 2U3-Node UP front I/O short-depth server

Key Applications

  • Multi-Access Edge Computing (MEC)
  • VRAN/ORAN for Telecom
  • Enterprise Edge

Key Features

Three hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:

  1. Single Socket E (LGA-4677) 5th Gen Intel® Xeon®/4th Gen Intel® Xeon Scalable processors (per node)
  2. 8 DIMMs; Up to 2TB 3DS ECC DDR5-5600MT/s; RDIMM/LRDIMM (per node)
  3. 2 PCIe Gen5 x16 FHHL slot and 1 PCIe Gen5 x16 HHHL slot (per node)
  4. 2 NVMe M.2 2280/22110 (per node)
  5. 4 counter-rotated fan speed control (per node); 1 Air Shroud (per node)
  6. Front-access 2000W AC Redundant Power Supplies (per system)
  7. Operating Temperature 0°C to 35°C ( 32°F to 95°F ) CPU TDP max 300W
    Operating Temperature 0°C to 55°C ( 32°F to 131°F ) CPU TDP max 205W
    Operating Temperature -5°C to 55°C ( 23°F to 131°F ) CPU TDP max 205W (Short Term)
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SYS-211SE-31A
Specifications Free Remote Testing Resources & Downloads Parts List
Specifications
Product SKUs
SuperServer SYS-211SE-31A
Motherboard
Super X13SEED-F
Processor (per Node)
CPU
Core Count
  • Up to 52C/104T; Up to 97.5MB Cache
Note
  • Supports 85W - 300W TDP CPUs (Air Cooled)*
  • *Air Cooled CPUs with TDP over 205W only supported under specific conditions. Contact a Supermicro representative for details.
System Memory (per Node)
Memory
Memory Voltage
  • 1.1V
On-Board Devices (per Node)
Chipset
  • Intel® C741
Network Connectivity
Input / Output (per Node)
LAN
  • 1 RJ45 1 GbE LAN port (Intel® I210-AT) (IPMI shared on LAN port 1)
TPM
  • 1 TPM header
Others
  • 1 KVM dongle (output 1x VGA/1x COM/2x USB 2.0 via KVM cable) port
System BIOS
BIOS Type
  • AMI 256MB SPI Flash
Management
Software
Power configurations
  • Power-on mode for AC power recovery
  • ACPI Power Management
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
  • Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features
  • Cryptographically Signed Firmware
  • Secure Boot
  • Secure Firmware Updates
  • Automatic Firmware Recovery
  • Supply Chain Security: Remote Attestation
  • Runtime BMC Protections
  • System Lockdown
PC Health Monitoring
CPU
  • Monitors for CPU Cores, Chipset Voltages, Memory
FAN
  • Fans with tachometer monitoring
  • Pulse Width Modulated (PWM) fan connectors
  • Status monitor for speed control
Temperature
  • CPU thermal trip support, PEPI
  • Monitoring for CPU and chassis environment
Chassis
Form Factor
  • 2U Rackmount
Model
  • CSE-SE201-R2K07P
Dimensions and Weight
Height
  • 3.5" (88 mm)
Width
  • 17.7" (449 mm)
Depth
  • 16.9" (430 mm)
Package
  • 9.5" (H) x 29.5" (W) x 23.2" (D)
Weight
  • Gross Weight: 70.6 lbs (32 kg)
  • Net Weight: 55.1 lbs (25 kg)
Available Color
  • Silver
Front Panel
Buttons
  • Power On/Off
  • UID button
LED
  • LAN1 activity
  • Power status
  • System information
Expansion Slots (per Node)
PCI-Express (PCIe) Configuration
Drive Bays / Storage (per Node)
M.2
  • 2 M.2 PCIe 5.0 x4 NVMe slots (M-key 2280/22110; VROC required for RAID)
  • Ver opciones M.2
System Cooling
Fans
  • Up to 12x 4cm heavy duty fans with optimal fan speed control 40x40x56mm Fan(s)
Air Shroud
  • 3 Air Shrouds
Power Supply
Operating Environment
ROHS
  • RoHS Compliant
Environmental Spec.
  • Operating Temperature: 0°C to 35°C (32°F to 95°F)
  • Non-operating Temperature: -40°C to 70°C (-40°F to 158°F)
  • Operating Relative Humidity: 8% to 90% (non-condensing)
  • Non-operating Relative Humidity: 5% to 95% (non-condensing)
Free Remote Testing

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Programar el acceso
Resources & Downloads
Parts List
Optional Parts List
Part Number Qty Description
Optional sliding rail kit MCP-290-00144-1N - 2U fixed rail set, quick release, default for 2,3U 17.6"W, 26.5"-33.5" D
TPM security module AOM-TPM-9670V - SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor

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