Blade SBI-622BA-1NE12-LCC (Complete System Only)

  Products  SuperBlade   [ SBI-622BA-1NE12-LCC ]









Integrated Board
B14DBE-AP


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Key Applications
  - Enterprise Applications
  - High Performance Computing
  - Engineering/scientific research
  - Cloud, virtualization, financial, EDA

 


Key Features

1. 80 servers per 48U rack
2. Dual Socket BR (LGA-7529), Intel® Xeon® 6900-series processors with P-cores up to 500W TDP
3. Up to 24 DIMMs supporting up to 6TB 6400MT/s DDR5 RDIMM or 6TB 8800MT/s DDR5 MRDIMM
4. 4 NVMe SSDs with 2 Hot-swap E1.S SSD (PCIe Gen5) and 2 M.2 (PCIe Gen5)
5. Dual-port 25G Ethernet (Lan On Motherboard) with Intel® E810
6. Expansion slot with one standard PCIe FHHL card, one HHHL/LP card and one OCP 3.0 PCIe card
7. Direct liquid cooling solution*
* Please contact your Supermicro sales rep for more info.


 
Note: Complete system should include at least 1 CPU & 1 DIMM.

 Drivers & Utilities  BIOS / BMC  Manuals  Tested Memory

 Tested AOC  Tested NVMe  Tested M.2 List   OS Certification Matrix Compatible GPU List  Quick-References Guide  Download Driver CD

NOTE: Please email to support@supermicro.com for more information about upgrading to latest BIOS/BMC


 


Product SKUs
SuperBlade Sled
  • SBI-622BA-1NE12-LCC
Motherboard
  • MBD-B14DBE-AP
 
Processor
CPU
Note
  • Supports up to 500W TDP CPUs*
  • Liquid cooling required*
  • * Please contact your Supermicro sales rep for more info.
GPU
CPU-GPU Interconnect
  • Up to 2 LP PCIe 5.0 x16 single-width GPUs
 
System Memory
Memory Capacity
  • 24 DIMM slots
  • Up to 6TB 6400MT/s DDR5 RDIMM or 6TB 8800MT/s DDR5 MRDIMM
Memory Type
  • ECC DDR5 RDIMM (3DS) up to 256GB of memory with speeds up to 6400 MT/s; ECC Registered MRDIMM up to 256GB of memory with speed up to 8800MT/s
DIMM Sizes
  • RDIMM (3DS) 16GB, 32GB, 48GB, 64GB, 96GB, 128GB, 256GB; MRDIMM 32GB, 48GB, 64GB, 96GB, 128GB, 256GB
Memory Voltage
  • 1.1V
Error Detection
  • Corrects single-bit errors
  • Detects double-bit errors (using ECC memory)
 
On-Board Devices
Chipset
  • System on Chip
Network Controllers
  • Onboard Dual 25G Ethernet port with Intel® Controller E810-XXVAM2
  • 1 expansion slot with optional mezzanine cards with Dual 25G Ethernet port
MGMT/Security
  • IPMI 2.0 / KVM over IP / Redfish API/TPM 2.0/Signed Firmware/HW Root of Trust
Graphics
  • Aspeed AST2600
 
System BIOS
BIOS Type
  • 64MB SPI Flash EEPROM with AMI® BIOS
Dimensions
Height
  • 9.75"
Width
  • 1.75"
Depth
  • 23.5"
Weight
  • 15.2 lbs (6.89 kg)
Available Colors
  • Metalic Silver with Black Drive Bays
 
Front Panel
Buttons
  • Power On/Off button
LEDs
  • Power LED
  • UID LED
  • Network Activity LED
  • Fault LED
 
Expansion Slots
PCIe
  • 3 PCIe 5.0 x16 slots supporting 1 FHHL single-width PCIe card, 1 HHHL/LP single-width PCIe card, and 1 OCP 3.0 card
 
Drive Bays / Storage
Hot-swap
  • 2 Hot-swap E1.S drive bays
M.2
  • Optional: 2 M.2 2280 or 2 M.2 22110 NVMe SSDs via adapter
 
Input / Output
TPM
  • 1 TPM 2.0 Header
 
Operating Environment
RoHS
  • RoHS Compliant
Environmental Spec.
  • Operating Temperature:

       10°C ~ 35°C (50°F ~ 95°F)
  • Non-operating Temperature:

       -40°C to 60°C (-40°F to 140°F)
  • Operating Relative Humidity:

       8% to 90% (non-condensing)
  • Non-operating Relative Humidity:

       5% to 95% (non-condensing)


Optional Parts List
  Part Number Qty Description
TPM security module

(optional, not included)		 AOM-TPM-9670V
AOM-TPM-9671V		 - TPM module (Vertical) TPM 2.0
TPM module (Vertical) TPM 1.2.
VROC AOC-VROCPREMOD
AOC-VROCSTNMOD		 - Intel VROC Premium, RAID 0, 1, 5, 10
Intel VROC HW key (RSTe) standard upgrade module
CPU Carrier SKT-1554H-BK00-FXC - Socket BR (LGA7529) GNR-AP Carrier
Liquid Cooling Module LCS-SLCM-X0057 - X14 AP B14DBE-AP liquid cooling module
M.2 AOM-B-2M5-P - Dual M.2 adapter card with two PCIe 5.0 x4 M.2 support
Software SFT-DCMS-Single - DataCenter Management Package (per node license)
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