X13SEDW-F

Key Features


  1. 5th/4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP
  2. Intel C741® Chipset
  3. Up to 4TB 3DS ECC RDIMM, DDR5-5600MT/s (1DPC) or DDR5-4400MT/s (2DPC) in 16 DIMM slots
  4. 2 PCIe 5.0 x16 4C
    1 PCIe 5.0 x8 AIOM
    1 PCIe 5.0 x0 AIOM
    M.2 Interface: 2 PCIe 3.0 x2
    M.2 Form Factor: 2280, 22110
    M.2 Key: M-Key
  5. 8 MCIO PCIe 5.0 x4 connectors
     1 MCIO PCIe 5.0 x8 connectors
  6. AIOM for LAN
  7. I/O: 1 VGA, 1 COM, 1 TPM header, 1 NC-SI header
  8. Intel® C741 controller for 12 SATA3 (6 Gbps) ports  
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Optimized Servers


Specifications Resources Parts List
Specifications
Product SKUs
MBD-X13SEDW-F
Physical Stats
Form Factor
  • Proprietary CloudDC
Dimension
  • 13" x 13" (33.02cm x 33.02cm)
Processor
CPU
Core
  • Up to 64 cores
System Memory
Memory Capacity
  • 16 DIMM slots
  • Up to 4TB 3DS ECC RDIMM, DDR5-5600MHz
  • **24GB & 48GB DIMM only support 1 DPC.
  • *24GB/48GB/96GB DDR5 DIMMs with 24Gb chip are only supported by 5th and 4th XCC Gen Intel® Xeon-SP CPU.
Memory Type
  • 5600/5200/4800/4400/4000 MT/s ECC DDR5 RDIMM (3DS) Up to 256GB of memory with speeds of up to 4400MT/s (2DPC)
DIMM Sizes
  • 16GB, 24GB, 32GB, 48GB, 64GB, 96GB, 128GB, 256GB
Memory Voltage
  • 1.1V
Error Detection
  • Corrects single-bit errors
On-Board Devices
Chipset
  • Intel® C741
SATA
  • Intel® C741 controller for 12 SATA3 (6 Gbps) ports; RAID 0,1,5,10
IPMI
  • ASPEED AST2600 BMC
Graphics
  • 1 Aspeed AST2600 BMC port(s)
Network Controllers
  • AIOM for LAN
Input / Output
SATA
  • 12 SATA3 (6Gbps) port(s)
LAN
  • 1 AIOM
  • 1 AIOM
USB
  • 2 USB 2.0 port(s) (2 via header)
  • 2 USB 3.2 Gen1 port(s) (2 rear)
Video Output
  • 1 VGA D-Sub Connector port(s)
Serial Port
  • 1 COM Port(s) (1 header)
TPM
  • 1 TPM Header
Expansion Slots
PCIe
  • 1 PCIe 5.0 x8 AIOM,
  • 1 PCIe 5.0 x0 AIOM,
  • 2 PCIe 5.0 x16 4C slots,
  • 8 PCIe 5.0 x4 PCIe5.0 MCIO connector,
  • 1 PCIe 5.0 x8 PCIe5.0 MCIO connector
M.2
  • M.2 Interface: 2 PCIe 3.0 x2
  • Form Factor: 2280/22110
  • Key: M-Key
System BIOS
BIOS Type
  • AMI UEFI
BIOS Features
  • ACPI 6.4
  • SMBIOS 3.5
  • UEFI 2.8 or above
Management
Software
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
PC Health Monitoring
Voltage
  • VBAT, System level control, Supports system management utility, Monitors CPU voltages, Chipset Voltage, Chassis intrusion header, 6 -fan status, +5V standby, +5V, +3.3V, +12V, Memory Voltages
LED
  • UID/Remote UID
  • CPU / System Overheat LED
Temperature
  • Monitoring for CPU and chassis environment
  • CPU thermal trip support
  • Thermal Monitor 2 (TM2) support
  • PECI
FAN
  • 6x 4-pin fan headers (up to 6 fans)
  • Fan speed control
  • 6 fans with tachometer status monitoring
  • Overheat LED indication
Other Features
  • WOL, UID, Node Manager Support, M.2 NGFF connector, Control of power-on for recovery from AC power loss, Chassis intrusion detection, ACPI power management
Resources
Parts List
X13SEDW-F (For SuperServer Only)