SuperServer SYS-110P-FDWTR

Intel Xeon Socket P+ (LGA-4189) 3rd Gen, 600W -48 Vdc redundant PWS, 1U edge platform

SMC Global
Integrated Board: X12SPW-TF
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Key Applications

  • Multi-Access Edge Computing (MEC)
  • DU of 5G Application
  • Satellite Communication
  • VRAN/ORAN for Telecom
  • Edge AI

Key Features

  1. Socket P+ (LGA-4189) support 3rd Gen Intel® Xeon® Scalable processors
  2. 8 DIMMs; Up to 2TB 3DS ECC DDR4-3200: RDIMM/LRDIMM
  3. 2x 2.5" drive bays; 1 M.2 NVMe OR 1 M.2 SATA3
  4. 6 heavy duty fans with optimal fan speed control; 1 Air Shroud(s)
  5. 600W -48V Redundant Power Supplies Level (92%+)
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SYS-110P-FDWTR
Specifications Free Remote Testing Resources & Downloads Parts List
Specifications
Product SKUs
SuperServer SYS-110P-FDWTR
Motherboard
Super X12SPW-TF
Processor
CPU
  • Single Socket P+ (LGA-4189)
  • 3rd Gen Intel® Xeon® Scalable processors
Core Count
  • Up to 32C/64T; Up to 48MB Cache
Note
  • Supports 85W - 205W TDP CPUs (Air Cooled)
System Memory
Memory
  • Slot Count: 8 DIMM slots
  • Max Memory (1DPC): Up to 2048GB 3200MT/s ECC DDR4 RDIMM/LRDIMM
  • View Memory Options
Memory Voltage
  • 1.2V
On-Board Devices
SATA
  • SATA (6Gbps) ; RAID 0/1 support
Chipset
  • Intel® C621A
Network Connectivity
Input / Output
LAN
  • 1 RJ45 1 GbE Dedicated BMC LAN port
  • 2 RJ45 10 GbE LAN ports (Intel® X550-AT2)
USB
  • 2 USB 2.0 Type-A ports
  • 2 Type-A ports
Video
  • 1 VGA port
Management
Software
Power configurations
  • Power-on mode for AC power recovery
  • ACPI Power Management
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
  • Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features
  • Cryptographically Signed Firmware
  • Secure Boot
  • Secure Firmware Updates
  • Automatic Firmware Recovery
  • System Lockdown
PC Health Monitoring
CPU
  • Monitors for CPU Cores, Chipset Voltages, Memory
FAN
  • Fans with tachometer monitoring
  • Pulse Width Modulated (PWM) fan connectors
  • Status monitor for speed control
Temperature
  • CPU thermal trip support, PEPI
  • Monitoring for CPU and chassis environment
Chassis
Form Factor
  • 1U
Model
Dimensions and Weight
Height
  • 1.7" (43 mm)
Width
  • 17.2" (437 mm)
Depth
  • 16.9" (429 mm)
Package
  • 8" (H) x 27" (W) x 24" (D)
Weight
  • Gross Weight: 14.99 lbs (6.8 kg)
  • Net Weight: 10.01 lbs (4.54 kg)
Available Color
  • No Paint
Front Panel
Buttons
  • Power On/Off button
LED
  • Fan Fail/System Over Heat LED
  • Power LED
Expansion Slots
PCI-Express (PCIe) Configuration
Drive Bays / Storage
Drive Bays Configuration
M.2
System Cooling
Fans
  • Up to 6 heavy duty fans with optimal fan speed control
Air Shroud
  • 1 Air Shroud
Power Supply
2x 600W
2x 600W Redundant (1 + 1) Typical 90%+ Level (96%) power supplies
Dimension (WxHxL)54.5 x 40 x 220 mm
Input600W: -44--65Vdc / 50-60Hz
+12VMax: 50A / Min: 0A
Max: 50A
5V SBMax: 3A / Min: 0A
Output TypeBackplanes (gold finger)
Operating Environment
Environmental Spec.
  • Operating Temperature: 0°C to 40°C (32°F to 104°F)
  • Non-operating Temperature: -40°C to 70°C (-40°F to 158°F)
  • Operating Relative Humidity: 8% to 90% (non-condensing)
  • Non-operating Relative Humidity: 5% to 95% (non-condensing)
Free Remote Testing

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Resources & Downloads
Parts List
Optional Parts List
Part Number Qty Description
TPM security module AOM-TPM-9670V - SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor
AOM-TPM-9671V - SPI capable TPM 1.2 with Infineon 9670 controller with vertical form factor

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