SuperServer SYS-110P-FDWTR-NEBS-DC

Intel Xeon Socket P+ (LGA-4189) 3rd Gen, 600W -48 Vdc redundant PWS, NEBS Level 3 certified 1U edge platform

Nebs Certified
Integrated Board: X12SPW-TF
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Key Applications

  • Multi-Access Edge Computing (MEC)
  • VRAN/ORAN for Telecom
  • Outdoor DU for 5G/RAN

Key Features

  1. NEBS Level 3 certified for Telecommunication
  2. Socket P+ (LGA-4189) support 3rd Gen Intel® Xeon® Scalable processors
  3. 8 DIMMs; Up to 2TB 3DS ECC DDR4-3200: RDIMM/LRDIMM
  4. 2x 2.5" drive bays; 1 M.2 NVMe OR 1 M.2 SATA3
  5. 6 heavy duty fans with optimal fan speed control; 1 Air Shroud(s)
  6. 600W Redundant Power Supplies Level (92%+)
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SYS-110P-FDWTR-NEBS-DC
Specifications Free Remote Testing Resources & Downloads Parts List
Specifications
Product SKUs
SuperServer SYS-110P-FDWTR-NEBS-DC
Motherboard
Super X12SPW-TF
Processor
CPU
  • Single Socket P+ (LGA-4189)
  • 3rd Gen Intel® Xeon® Scalable processors
Core Count
  • Up to 32C/64T; Up to 48MB Cache
Note
  • Supports 85W - 205W TDP CPUs (Air Cooled)
System Memory
Memory
  • Slot Count: 8 DIMM slots
  • Max Memory (1DPC): Up to 2048GB 3200MT/s ECC DDR4 RDIMM/LRDIMM
  • View Memory Options
Memory Voltage
  • 1.2V
On-Board Devices
SATA
  • SATA (6Gbps) ; RAID 0/1 support
Chipset
  • Intel® C621A
Network Connectivity
Input / Output
USB
  • 2 USB 2.0 Type-A ports
  • 2 Type-A ports
Video
  • 1 VGA port
Management
Software
Power configurations
  • Power-on mode for AC power recovery
  • ACPI Power Management
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
  • Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features
  • Cryptographically Signed Firmware
  • Secure Boot
  • Secure Firmware Updates
  • Automatic Firmware Recovery
  • System Lockdown
PC Health Monitoring
CPU
  • Monitors for CPU Cores, Chipset Voltages, Memory
FAN
  • Fans with tachometer monitoring
  • Pulse Width Modulated (PWM) fan connectors
  • Status monitor for speed control
Temperature
  • CPU thermal trip support, PEPI
  • Monitoring for CPU and chassis environment
Chassis
Form Factor
  • 1U
Model
Dimensions and Weight
Height
  • 1.7" (43 mm)
Width
  • 17.2" (437 mm)
Depth
  • 16.9" (429 mm)
Package
  • 8" (H) x 27" (W) x 24" (D)
Weight
  • Gross Weight: 14.99 lbs (6.8 kg)
  • Net Weight: 10.01 lbs (4.54 kg)
Available Color
  • No Paint
Front Panel
Buttons
  • Power On/Off button
LED
  • Fan Fail/System Over Heat LED
  • Power LED
Expansion Slots
PCI-Express (PCIe) Configuration
Drive Bays / Storage
Drive Bays Configuration
M.2
System Cooling
Fans
  • Up to 6 heavy duty fans with optimal fan speed control
Air Shroud
  • 1 Air Shroud
Power Supply
2x 600W
2x 600W Redundant (1 + 1) Typical 90%+ Level (96%) power supplies
Dimension (WxHxL)54.5 x 40 x 220 mm
Input600W: -44--65Vdc / 50-60Hz
+12VMax: 50A / Min: 0A
Max: 50A
5V SBMax: 3A / Min: 0A
Output TypeBackplanes (gold finger)
Operating Environment
Environmental Spec.
  • Operating Temperature: 0°C to 40°C (32°F to 104°F)
  • Non-operating Temperature: -40°C to 70°C (-40°F to 158°F)
  • Operating Relative Humidity: 8% to 90% (non-condensing)
  • Non-operating Relative Humidity: 5% to 95% (non-condensing)
Free Remote Testing

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Resources & Downloads
Parts List
Optional Parts List
Part Number Qty Description
TPM security module AOM-TPM-9670V - SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor
AOM-TPM-9671V - SPI capable TPM 1.2 with Infineon 9670 controller with vertical form factor
NEBS Qualified Parts List
Part Number Qty Description
Add on Cards AOC-623106AC-CDAT - Mellanox MCX623106AC-CDAT PCIe 2-port 100GbE QSFP56 Gen4x16 CX-6
AOC-E810-2CQDA2 (E810 2x 100G) - Intel E810-2CQDA2 PCIe 2-port 100GbE QSFP28 Gen4x16
AOC-E810-XXVDA4 - Intel E810-XXVDA4 PCIe 4-port 25GbE SFP28 Gen4x16
AOC-P3IMB-M-P2 - Silicom P3iMB-M-P2 Accelerator Server Adapter Gen3x16
AOC-S100GC-I2C-P - Standard PCIe 4.0 x 16 dual port 100GbE with QSFP28 based on Intel E810-CAM2
AOC-S25GC-I4S-P - PCIe Gen 4 standard low profile quad port SFP28 based on Intel E810-CAM1)
CPU P4X-ICX6314U-SRKHL - ICX 6314U 1P 32C/64T 2.3G 48M 11.2GT 205W
P4X-ICX6338N-SRKY2 - ICX 6338N 2P 32C/64T 2.2G 48M 11.2GT 185W
Memory MEM-DR412L-SL01-ER32 - 128GB DDR4-3200 4Rx4 LP (16Gb) ECC 3DS RDIMM
MEM-DR416L-CL06-ER32 - 16GB DDR4-3200 2RX8 LP ECC RDIMM
MEM-DR416L-SL02-ER32 - 16GB DDR4-3200 2Rx8 LP ECC RDIMM
MEM-DR432L-CL06-ER32 - 32GB DDR4-3200 2RX4 LP ECC RDIMM
MEM-DR432L-HL02-ER32 - 32GB DDR4-3200 2Rx4 ECC REG DIMM
MEM-DR432L-SL05-ER32 - 32GB DDR4-3200 2Rx4 LP ECC RDIMM
MEM-DR464L-HL02-ER32 - 64GB DDR4-3200 2Rx4 (16Gb) ECC RDIMM
MEM-DR464L-SL01-ER32 - 64GB DDR4-3200 2Rx4 LP (16Gb) ECC RDIMM
Storage HDS-I2T0-SSDSC2KB960G8 - Intel D3-S4510 960GB SATA 6Gb/s 3D TLC 2.5" 7mm
HDS-IMT0-SSDSCKKB960G8 - Intel D3 S4510 960GB M.2 SATA 6Gb/s 3D TLC 22x80mm
HDS-S2T1-MZ7LH960HAJR05 - Samsung PM883 960GB SATA 6Gb/s V4 TLC 2.5" 7mm
HDS-SMN1-MZ1LB960HAJQ07 - Samsung PM983 960GB NVMe PCIe3x4 V4 M.2 22x110mm
TPM security module AOM-TPM-9670V - SPI TPM 2.0 using SLB9670
AOM-TPM-9671V - Vertical TPM with Infineon 9670, 1.2FW

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