H13SSFR

H13 UP FatTwin Server Board

Key Features


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Specifications Resources
Specifications
Product SKUs
MBD-H13SSFR
Physical Stats
Form Factor
  • Proprietary
Dimension
  • 8.44" x 18" (21.43cm x 45.72cm)
Processor
CPU
Core Count
  • Up to 96C/192T
Note
  • Supports up to 400W TDP CPUs
System Memory
Memory
  • Slot Count: 12 DIMM Slots
Error Detection
  • Corrects single-bit errors
  • Detects double-bit errors (using ECC memory)
On-Board Devices
Chipset
  • System on Chip
Input / Output
LAN
  • 1 RJ45 1 GbE Dedicated IPMI LAN port(s)
USB
  • 2 USB 3.0 port(s)
Video
  • 1 VGA port(s)
TPM
  • 1 TPM 2.0 Header
Others
  • 6 MCIO (PCIe 5.0 x8) port(s)
  • 1 SlimSAS (x4) port(s)
  • 1 SlimSAS (x2) port(s)
Expansion Slots
PCI-Express (PCIe) Configuration
  • 1 PCIe 5.0 x16 Right Riser slot
  • 1 PCIe 5.0 x16 AIOM Networking slot
M2
  • 2 M.2 PCIe 3.0 x4 slots (M-Key 2280/22110)
System BIOS
BIOS Type
  • AMI 32MB SPI Flash EEPROM
BIOS Features
  • ACPI 6.4;SMBIOS 3.5 or later;UEFI 2.8;Plug and Play (PnP);USB Keyboard support
Management
Software
Power Configurations
  • ACPI Power Management
  • Power-on mode control for AC power loss recovery
  • Power button override mechanism
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
PC Health Monitoring
Voltage
  • +12V
  • +3.3V
  • +5V
  • +5V standby
  • 3.3V standby
  • CPU temperature
  • CPU thermal trip support
LED
  • BMC/IPMI Heartbeat LED
  • CPU/system overheat LED
  • UID/remote UID LED
FAN
  • 4x 4-pin fan headers (up to 4 fans)
Operating Environment
Environmental Spec.
  • Operating Temperature: 10°C to 35°C (50°F to 95°F )
  • Non-operating Temperature: -40°C to 70°C (-40°F to 158°F)
  • Operating Relative Humidity: 8% to 90% (non-condensing)
  • Non-operating Relative Humidity: 5% to 95% (non-condensing)
Resources
Parts List

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