X13DEG-R

X13DEG-R
X13 DP GPU Server Board

Key Features


  1. 5th/4th Gen Intel® Xeon® Scalable processors and Intel® Xeon® Max series processors, Dual Sockets LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP
  2. Intel® C741 Chipset
  3. Up to 8TB 3DS ECC RDIMM, DDR5-5600MT/s in 32 DIMM slots
  4. 18 PCIe 5.0 MCIO x8 (8 for GPU Module; 8 for Riser Card; 2 for NVMe)
  5. Dual LAN with Intel X710 10GbE
  6. 2 PCIe 3.0 x4 Hybrid M.2
  7. 1 VGA via AOM Card
  8. 4 SATA3 port s via SlimSAS-LP x4
  9. 2 USB 3.0 via AOM Card + 1 USB 3.0 onboard
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Optimized Servers


SYS-221GE-TNHT-LCC
Specifications Resources Parts List
Specifications
Product SKUs
MBD-X13DEG-R
Physical Stats
Form Factor
  • Proprietary
Dimension
  • 17.3" x 15.7" (44cm x 39.9cm)
Processor
CPU
Core Count
  • Up to 64C
Note
  • Supports up to 350W TDP CPUs
System Memory
Memory
  • Slot Count: 32 DIMM Slots
  • Max Memory (2DPC): Up to 8TB 5600MT/s ECC DDR5 RDIMM/LRDIMM
DIMM Sizes
  • RDIMM:8GB, 16GB, 32GB, 64GB, 96GB, 128GB, 256GB
Memory Voltage
  • 1.1V
Error Detection
  • Corrects single-bit errors
  • Detects double-bit errors (using ECC memory)
On-Board Devices
Chipset
  • Intel® C741
SATA
  • SATA (6Gbps) via Intel® C741; via SlimSAS LP
IPMI
  • ASPEED AST2600 BMC
Network Controller
  • AIOM for LAN
Input / Output
LAN
  • 2 AIOM 10 GbE LAN port(s) (IPMI shared on LAN port 1)
  • 1 AIOM 1 GbE Dedicated BMC LAN port(s) (Realtek RTL8211F PHY)
USB
  • 2 USB 3.2 Gen1 Type-A port(s) (rear)
Video
  • 1 Aspeed AST2600 BMC port(s) (Rear)
TPM
  • 1 TPM header
Expansion Slots
PCI-Express (PCIe) Configuration
  • 18 PCIe 5.0 x8 via MCIO Connector slots
  • 1 PCIe 5.0 x16 AIOM slot
M2
  • 2 M.2 PCIe 3.0 x4 NVMe slots (M-key 2280/22110)
System BIOS
BIOS Type
  • AMI 32MB UEFI
BIOS Features
  • Plug and Play (PnP)
  • PCI FW 3.2
  • ACPI 6.4
  • UEFI 2.8A
  • SMBIOS 2.8/3.5
Management
Software
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
PC Health Monitoring
Voltage
  • +12V
  • +3.3V
  • +5V
  • +5V standby
  • Chassis intrusion header
  • Chipset voltage
  • Memory Voltages
  • Monitors CPU voltages
  • Supports system management utility
  • System level control
  • VBAT
LED
  • CPU/system overheat LED
  • UID/remote UID LED
Temperature
  • CPU thermal trip support
  • Monitoring for CPU and chassis environment
  • PECI
FAN
  • Fan speed control
Other Features
  • ACPI power management
  • Chassis intrusion detection
  • Control of power-on for recovery from AC power loss
  • M.2 NGFF connector
  • Node manager support
  • UID
Operating Environment
Environmental Spec.
  • Operating Temperature: 10°C to 35°C (50°F to 95°F )
  • Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
  • Operating Relative Humidity: 8% to 80% (non-condensing)
  • Non-operating Relative Humidity: 5% to 95% (non-condensing)
Resources
Servers (Optimized for X13DEG-R)
SYS-221GE-TNHT-LCC
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Component Options
CPU List
Tested AOC List
Tested HDD / SSD List
Tested M.2 List
Tested Memory List
Software
BMC Firmware
Download Driver CD
Download the Latest Drivers and Utilities
OS Compatibility
Update Your BIOS
Documentation
Motherboard Manual
Quick Reference Guide
Parts List
Standard Parts (Retail Package)
Part Number Qty Description
CPU carrier SKT-1333L-0000-FXC 2 CPU carrier for 4th Gen Intel® Xeon® Scalable processors (XCC)
SKT-1424L-001B-LTS 2 CPU carrier for 4th Gen Intel® Xeon® Scalable processors (MCC)
SKT-1425H-001C-FXC 2 CPU carrier for 4th Gen Intel® Xeon® Scalable processors Max Series (HBM)

X13DEG-R

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