X13SCD-F

X13 UP MicroCloud Server Board

Key Features


  1. Intel® Xeon® 6300-series Processor, E-2400 Series Processor, Pentium®* Processor, Single Socket LGA-1700 (Socket V0) supported, CPU TDP supports Up to 95W TDP
  2. Up to 128GB ECC Unbuffered DIMM, DDR5-4400MHz, in 4 DIMM slots
  3. 1 PCIe 4.0 x8 (Micro Low Profile) + 1 PCIe 5.0 x8 (Low Profile, Open End)
  4. 1 VGA Port;2 USB 2.0 Ports; 1 Serial Port via KVM Connector
  5. M.2 Interface: 2x SATA3/PCIe 4.0 x4, M.2 Form Factor: 2242/2280, 22110 for one slot only
  6. 1 Dedicated IPMI LAN via Backplane to the Centralized Management Port
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Optimized Servers


Specifications Resources
Specifications
Product SKUs
MBD-X13SCD-F
Physical Stats
Form Factor
  • Proprietary
Dimension
  • 4.75" x 15.69" (12.07cm x 39.85cm)
Processor
CPU
  • Single Socket V0 (LGA-1700)
  • Intel® Xeon ® 6300-series/ E-2400/Pentium®* Processor
  • *BIOS 2.0 or above is required to support Intel® Xeon® 6300-series processor
Core Count
  • Up to 8C
Note
  • Supports up to 95W TDP CPUs
System Memory
Memory
  • Slot Count: 4 DIMM Slots/2 Channels
  • Max Memory (2DPC): Up to 128GB 4400MT/s ECC DDR5 UDIMM
DIMM Sizes
  • UDIMM:16GB, 32GB, 48GB
Memory Voltage
  • 1.1V
Error Detection
  • Corrects single-bit errors
  • Detects double-bit errors (using ECC memory)
On-Board Devices
Chipset
  • Intel® C266
SATA
  • SATA (6Gbps) via Intel® C266; RAID 0/1 support
IPMI
  • ASPEED AST2600 BMC
Input / Output
USB
  • 1 USB 3.2 Gen2 Type-C port(s)
  • 2 USB 2 port(s) (via KVM connector)
Video
  • 1 VGA port(s) (via KVM connector)
Serial
  • 1 COM port(s) (via KVM connector)
TPM
  • 1 TPM 2.0 Header & Chip both
Expansion Slots
PCI-Express (PCIe) Configuration
  • 1 PCIe 5.0 x8 LP slot
  • 1 PCIe 4.0 x8 MicroLP slot
M2
  • 2 M.2 PCIe 4.0 x4 SATA slots (M-key 2242/2280/22110)
System BIOS
BIOS Type
  • AMI 32MB UEFI
BIOS Features
  • Plug and Play (PnP)
  • ACPI 6.4
  • PCI FW 3.3
  • SMBIOS 3.5
  • UEFI 2.8
Management
Software
Power Configurations
  • ACPI Power Management
  • Power-on mode control for AC power loss recovery
  • Power button override mechanism
  • Wake-On-LAN
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
PC Health Monitoring
Voltage
  • +12V
  • +3.3V
  • +5V
  • +5V standby
  • 1-fan status
  • 1.8V standby
  • 3.3V standby
  • CPU temperature
  • CPU thermal trip support
  • Memory temperature
  • VBAT
  • VRM temperature
LED
  • BMC/IPMI Heartbeat LED
  • CPU/system overheat LED
  • Power LED
  • UID/remote UID LED
Temperature
  • CPU thermal trip support
  • Monitoring for CPU and chassis environment
  • PECI
FAN
  • Fan speed control
Operating Environment
Environmental Spec.
  • Operating Temperature: 10°C to 35°C (50°F to 95°F )
  • Non-operating Temperature: -40°C to 70°C (-40°F to 158°F)
  • Operating Relative Humidity: 8% to 90% (non-condensing)
  • Non-operating Relative Humidity: 5% to 95% (non-condensing)
Resources
Parts List

X13SCD-F

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