H13SSW

H13 UP CloudDC Server Board

Key Features


  1. AMD EPYC™ 9004/9005* Series Processors (*AMD EPYC™ 9005 series drop-in support requires board revision 2.x)
  2. System on Chip
  3. Support up to DDR5 12 DIMM slots (1DPC), speed up to 6400 MT/s (Please check System Memory Section for detail)
  4. 2 PCIe 5.0 x16 via riser slot; 8 PCIe 5.0 x8 via MCIO2; PCIe 5.0 x16 AIOM / OCP3.0 networking slot
  5. M.2 Interface: 2 PCIe 3.0 x2 (2280/22110)
  6. 16 SATA3 Hybrid via 2 PCIe 5.0 x8 MCIO
  7. 2 USB 3.0 from rear I/O + 2 USB2.0 via Header
  8. ASPEED AST2600 BMC graphics
...
...

Optimized Servers


Specifications Resources Parts List
Specifications
Product SKUs
MBD-H13SSW
Physical Stats
Form Factor
  • Proprietary
Dimension
  • 12.29" x 13.4" (31.22cm x 34.04cm)
Processor
CPU
Core Count
  • Up to 160C/320T
Note
  • Supports up to 400W TDP CPUs
System Memory
Memory
  • Slot Count: 12 DIMM Slots
  • Max Memory (1DPC): Up to 3TB 4800MT/s ECC DDR5 3DS RDIMM (AMD EPYC™ 9004 Series Processor, MB R1.x/R2.0/R2.01)
  • Max Memory (1DPC): Up to 3TB 6400MT/s ECC DDR5 3DS RDIMM (AMD EPYC™ 9005 Series Processor, MB R2.01)
  • Max Memory (1DPC): Up to 3TB 6000MT/s ECC DDR5 3DS RDIMM (AMD EPYC™ 9005 Series Processor, MB R2.0)
DIMM Sizes
  • RDIMM:16GB, 24GB, 32GB, 48GB, 64GB, 96GB, 128GB, 256GB
Memory Voltage
  • 1.1V
Error Detection
  • Corrects single-bit errors
  • Detects double-bit errors (using ECC memory)
On-Board Devices
SATA
  • SATA (6Gbps) via SoC
IPMI
  • ASPEED AST2600 BMC
Input / Output
LAN
  • 1 RJ45 1 GbE Dedicated IPMI LAN port(s)
USB
  • 2 USB 3.0 Type-A port(s) (Rear)
  • 2 USB 2.0 Type-A port(s) (Header)
Video
  • 1 VGA port(s)
  • 1 Aspeed AST2600 BMC port(s)
Serial
  • 1 COM port(s)
TPM
  • 1 TPM 2.0 Header
Others
  • 8 MCIO (PCIe 5.0 x8) port(s)
  • 2 AIOM port(s)
  • 6 System Fan port(s)
Expansion Slots
PCI-Express (PCIe) Configuration
  • 1 PCIe 5.0 x16 Right Riser slot
  • 1 PCIe 5.0 x16 Left Riser slot
  • 2 PCIe 5.0 x16 AIOM Networking slots
M2
  • 2 M.2 PCIe 3.0 x2 slots (M-key 2280/22110)
System BIOS
BIOS Type
  • AMI 32MB SPI Flash EEPROM
BIOS Features
  • ACPI 6.4
  • Plug and Play (PnP)
  • SMBIOS 3.5 or later
  • UEFI 2.8
  • USB Keyboard support
Management
Software
Power Configurations
  • ACPI Power Management
  • Power-on mode control for AC power loss recovery
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
PC Health Monitoring
Voltage
  • +12V
  • +3.3V
  • +5V
  • +5V standby
  • 1.8V standby
  • 3.3V standby
  • Chassis intrusion header
  • VBAT
LED
  • BMC/IPMI Heartbeat LED
  • UID/remote UID LED
FAN
  • 6x 4-pin fan headers (up to 6 fans)
Other Features
  • RoT
Operating Environment
Environmental Spec.
  • Operating Temperature: 10°C to 35°C (50°F to 95°F )
  • Non-operating Temperature: -40°C to 70°C (-40°F to 158°F)
  • Operating Relative Humidity: 8% to 90% (non-condensing)
  • Non-operating Relative Humidity: 5% to 95% (non-condensing)
Resources
Parts List
Optional Parts
Part Number Qty Description
TPM security module (optional, not included) AOM-TPM-9670H 1 SPI capable TPM 2.0 with Infineon 9670 controller with horizontal form factor
AOM-TPM-9670V 1 SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor

H13SSW New

Certain products may not be available in your region