X13QEH+

X13 MP Server Board

Key Features


  1. 4th Gen Intel® Xeon® Scalable processors, Dual Sockets LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP
  2. Intel C741® Chipset
  3. Up to 16TB 3DS RDIMM/RDIMM DDR5 (288-pin) ECC memory with speeds up to 4800Mhz in 64 DIMMs.  Up to 16TB PMem 300 Series Memory
  4. 2 PCIe 5.0 x 16 via Riser Card
  5. 1 PCIe 5.0 x16 and 1 PCIe 5.0 x8 via Riser Card
  6. 17 MCIO PCIe 5.0 x8 connectors for 24 NVMe SSDs via Riser Card
  7. 2 Nvme PCIe 3.0 x4/SATA 2.0 Hybrid M.2 ports
  8. 8 SATA 3.0 or 24 NVMe SSDs via Riser Card
  9. 1 MP
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Optimized Servers


Specifications Resources
Specifications
Product SKUs
MBD-X13QEH+
Physical Stats
Form Factor
  • Proprietary
Dimension
  • 16.8" x 22.87" (426.72cm x 580.9cm)
Processor
CPU
Core Count
  • Up to 64C
Note
  • Supports up to 350W TDP CPUs
System Memory
Memory
  • Slot Count: 64 DIMM Slots
  • Max Memory (2DPC): Up to 8TB ECC DDR5 RDIMM
DIMM Sizes
  • RDIMM:16GB, 32GB, 64GB, 128GB, 256GB
Memory Voltage
  • 1.1V
Error Detection
  • Corrects single-bit errors
  • Detects double-bit errors (using ECC memory)
On-Board Devices
Chipset
  • Intel® C741
Input / Output
USB
  • 2 Type-A port(s) (Rear)
Serial
  • 1 COM port(s) (rear)
System BIOS
BIOS Type
  • AMI 64MB UEFI
BIOS Features
  • ACPI 6.4; SMBIOS 2.8/3.5; UEFI 2.8A; Plug and Play (PnP); PCI FW 3.2
Management
Software
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
PC Health Monitoring
Voltage
  • +12V,+3.3V,+3.3V standby,+5V,+5V standby,CPU temperature,CPU thermal trip support,Fan speed control,Memory temperature,PCH temperature,Peripheral temperature,Platform Environment Control Interface (PECI)/(TSI),System temperature,Veore,Vmem
FAN
  • 8x 4-pin fan headers (up to 8 fans)
Resources
Parts List

X13QEH+

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