SuperServer SYS-211TP-HPTR

X13 SuperEdge 2U4-Node UP rear I/O server with 24 SATA bays

Integrated Board: X13SET-PT
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Key Applications

  • Multi-Access Edge Computing (MEC)
  • VRAN/ORAN for Telecom
  • Enterprise Edge

Key Features

Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:

  1. Single Socket E (LGA-4677) 5th/4th Gen Intel® Xeon® Scalable processors (per node)
  2. Intel® C741 Chipset
  3. 8 DIMMs; Up to 2TB ECC DDR5-5600MT/s R-DIMM / R-DIMM 3DS (per node)
  4. 2 PCIe Gen5 x16 HHHL slot (per node)
  5. 2 NVMe M.2 2280 / 25110 (per node)
    Front hot-swappable 2.5” HDD/SSD tray (6 tray per node)
  6. 4 heavy duty 8cm PWM fans with optimal fan speed control (Per System)
  7. 1+1 Redundant 2000W AC Power Supplies (per system)
  8. Intel® X710 Dual port 10G SFP+ onboard
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SYS-211TP-HPTR
Specifications Free Remote Testing Resources & Downloads Parts List
Specifications
Product SKUs
SuperServer SYS-211TP-HPTR
Motherboard
Super X13SET-PT
Processor (per Node)
CPU
Core Count
  • Up to 60C/120T; Up to 300MB Cache
Note
  • Supports 85W - 270W TDP CPUs (Air Cooled)
System Memory (per Node)
Memory
  • Slot Count: 8 DIMM slots/1 Channels
  • Max Memory (1DPC): Up to 2TB 5600MT/s ECC DDR5 RDIMM
  • View Memory Options
Memory Voltage
  • 1.1V
On-Board Devices (per Node)
SATA
  • SATA (6Gbps)
Chipset
  • Intel® C741
Network Connectivity
Input / Output (per Node)
LAN
  • 1 RJ45 1 GbE Dedicated BMC LAN port
  • 2 SFP+ 10 GbE LAN ports (IPMI shared on LAN port 1)
USB
  • 2 USB 3.2 Gen1 Type-A ports(rear)
Video
  • 1 VGA port(Rear)
System BIOS
BIOS Type
  • AMI 256MB SPI Flash
BIOS Features
  • RTC (Real Time Clock) Wakeup
  • SPI dual/quad speed support
  • Riser Card audio detection support
  • ACPI Power Management 6.4
  • SMBIOS 3.5 or later
  • PCI firmware 4.0
  • UEFI 2.9
Management
Software
Power configurations
  • ACPI Power Management
  • Power-on mode for power recovery
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
  • Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features
  • Cryptographically Signed Firmware
  • Secure Boot
  • Secure Firmware Updates
  • Automatic Firmware Recovery
  • Supply Chain Security: Remote Attestation
  • Runtime BMC Protections
  • System Lockdown
PC Health Monitoring
CPU
  • Monitors for CPU Cores, Chipset Voltages, Memory
FAN
  • Fans with tachometer monitoring
  • Pulse Width Modulated (PWM) fan connectors
  • Status monitor for speed control
Temperature
  • CPU thermal trip support, PEPI
  • Monitoring for CPU and chassis environment
Chassis
Form Factor
  • 2U Rackmount
Model
  • CSE-217HQ+-R2K04BP4
Dimensions and Weight
Height
  • 3.5" (88 mm)
Width
  • 17.25" (438 mm)
Depth
  • 28.75" (730 mm)
Package
  • 9.8" (H) x 20.7" (W) x 38" (D)
Weight
  • Gross Weight: 90 lbs (40.8 kg)
  • Net Weight: 70 lbs (31.8 kg)
Available Color
  • Black front & silver body
Front Panel
Buttons
  • Power On/Off button
  • UID button
LED
  • Network activity LED
  • Power status LED
  • System information (overheat/UID) LED
Expansion Slots (per Node)
PCI-Express (PCIe) Configuration
Drive Bays / Storage (per Node)
Drive Bays Configuration
M.2
  • 2 M.2 PCIe 5.0 x4 NVMe slots (M-key 2280/22110/25110; VROC required for RAID)
  • View M.2 Options
System Cooling
Fans
  • Up to 4 heavy duty fans with optimal fan speed control 8cm Fan(s)
Air Shroud
  • 4 Air Shrouds
Power Supply
Operating Environment
ROHS
  • RoHS Compliant
Environmental Spec.
  • Operating Temperature: 0°C to 35°C (32°F to 95°F)
  • Non-operating Temperature: 0°C to 70°C (32°F to 158°F)
  • Operating Relative Humidity: 8% to 90% (non-condensing)
  • Non-operating Relative Humidity: 5% to 95% (non-condensing)
Free Remote Testing

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Resources & Downloads
Parts List
Optional Parts List
Part Number Qty Description
TPM security module AOM-TPM-9670H-FIPS-O 1 AOM-TPM-9670H-FIPS supporting FIPS 140-2,RoHS

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