Key Applications
- AI/ML, Deep Learning Training and Inference
- High-performance Computing (HPC)
- Cloud Computing
- Research Laboratory/National Laboratory
- Autonomous Vehicle Technologies
- Molecular Dynamics Simulation
Key Features 1. High Density 2U System with NVIDIA® HGX™ A100 4-GPU; Highest GPU communication using NVIDIA® NVLINK™, 4 NICs for GPUDirect RDMA (1:1 GPU Ratio)2. Supports HGX A100 4-GPU 40GB (HBM2) or 80GB (HBM2e)3. Direct connect PCI-E Gen4 Platform with NVIDIA® NVLink™ v3.0 up to 600GB/s interconnect4. On board BMC supports integrated
IPMI 2.0 + KVM with dedicated 10G LAN5. Dual AMD EPYC™ 7003/7002 Series Processors (The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer)6. 8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs7. 4 PCI-E Gen 4 x16 (LP), 1 PCI-E Gen 4 x8 (LP)8. 4 Hot-swap 2.5" drive bays
(SAS/SATA/NVMe Hybrid)9. 2x 2200W Platinum Level power supplies with Smart Power Redundancy
Complete System Only: To maintain quality and integrity, this product is sold only as a completely-assembled system (with minimum 2 CPUs, 4 DIMMs, 4 GPUs installed). Add on Cards (AOC) are recommended to be installed by Supermicro due to optimized density of the 2U form factor. Service: OSNBD3 is highly recommended.
Dual AMD EPYC™ 7003/7002 Series Processors (The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer)
Socket SP3
Supports CPU TDP up to 280W*
Cores
Up to 128 Cores (64 per CPU)
Note
* Certain CPUs with high TDP may be supported only under specific conditions. Please contact Supermicro Technical Support for additional information about specialized system optimization
GPU Support
Supports HGX A100 4-GPU 40GB (HBM2) or 80GB(HBM2e) with NVLink GPU interconnect and PCI-E Gen4 host CPUs
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