概述
X14/H14 2U2N GrandTwin®
Purpose-Built Single-Socket Architecture with Front I/O and Modular Components
- CPU: Single Intel® Xeon® 6900 series processor with P-cores or AMD EPYC™ 9005 series processor per node
- Memory: Up to 12 DIMMs per node, 3TB DDR5
- Drives: Up to 6 front hot-swap 2.5" NVMe drives per node
- PCIe: Up to 2 PCIe 5.0 x16 (in x16) FH/10.5"L slots per node
X14/H14 GrandTwin® with PCIe 5.0
Purpose-Built Single-Socket Architecture with Front or Rear I/O and Modular Components
- CPU: Single Intel® Xeon® 6700/6500 series processor or AMD EPYC™ 9005/9004 series processor per node
- Memory: Up to 16 DIMMs per node, 6TB DDR5
- Drives: Up to 8 hot-swap EDSFF E1.S or 6 hot-swap 2.5" NVMe/SATA drives per node
- PCIe: Up to 1 PCIe 5.0 slot or 2 PCIe 5.0 x16 AIOM slots per node
X13/H13 GrandTwin® with PCIe 5.0
Purpose-Built Single-Socket Architecture with Front or Rear I/O and Modular Components (X13/H13)
- CPU: Single 5th/4th Gen Intel® Xeon® Scalable Processor or AMD EPYC™ 9004 Series Processor per node
- Memory: Up to 16 DIMMs per node, 4TB DDR5
- Drives: Up to 6x hot-swap 2.5" NVMe/SAS/SATA per node
- PCIe: Up to 2x PCIe 5.0 x16 AIOM per node
2U4N GrandTwin® with PCIe 4.0
Purpose-Built Single-Socket Architecture with Front or Rear I/O and Modular Components (X12)
- CPU: Single 3rd Gen Intel® Xeon® Scalable Processor per node
- Memory: Up to 16 DIMMs per node, 4TB DDR4, support for Intel® Optane® Persistent Memory
- Drives: Up to 4x hot-swap 2.5" NVMe/SAS/SATA per node
- PCIe: 1x PCIe 4.0 x16 per node
資源
X14 GrandTwin® 技術規格書
全新 X14 GrandTwin® 多節點系統，搭載具備 P-核心的 Intel® Xeon® 6700/6500 系列處理器，以及具備 E-核心的 6700 系列處理器
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