H13SAE-MF

H13 UP Workstation Workstation Board

Key Features


  1. AMD EPYC™ 4004 series, Ryzen™ 9000 & 8700G* & 7000 series desktop processor, single socket LGA-1718 (socket AM5), up to 170W
  2. Up to 192GB ECC/non-ECC unbuffered DIMM, DDR5-5200MHz, in 4 DIMM slots
  3. 2 PCIe 5.0 x16 (16/NA or 8/8), support up to 2 GPU cards (mechanical is up to 1 triple-width GPU card or 2 double-width GPU cards); 1 PCIe 4.0 x4
  4. Dual 1Gbit LAN ports (i210 AT); 1 dedicated Realtek 1Gbit LAN for IPMI
  5. Micro-ATX form factor
  6. 1 USB 3.2 Gen2x2 port (type C, 20Gb, rear); 5 USB 3.2 Gen2 ports (2 Type C, rear, support DP 1.4 Alt mode)
  7. 1 HDMI 2.0 port, 1 DP 1.4a port
  8. M.2 Interface: 2 PCIe 5.0 x4 (RAID 0 & 1) (2280/22110, M-Key)
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Optimized Servers


Specifications Resources Parts List
Specifications
Product SKUs
MBD-H13SAE-MF
Physical Stats
Form Factor
  • Micro-ATX
Dimension
  • 9.6" x 9.6" (24.384cm x 24.384cm)
Processor
CPU
  • Single Socket AM5 (LGA-1718)
  • AMD EPYC™ 4004 series, Ryzen™ 9000 & 8700G & 7000 Series Desktop Processors
Core Count
  • Up to 16C/32T
Note
  • Supports up to 170W TDP CPUs
System Memory
Memory
  • Slot Count: 4 DIMM Slots
  • Max Memory (1DPC): Up to 192GB 5200MT/s non-ECC DDR5 UDIMM
Memory Voltage
  • 1.1V
On-Board Devices
Chipset
  • B650
SATA
  • SATA (6Gbps) ; RAID 0/1/10 support
IPMI
  • ASPEED AST2600 BMC
Network Controller
  • Dual LAN with Intel® i210 Gigabit Ethernet Controller
  • Single LAN with ASPEED AST2600 BMC, Dedicated LAN for IPMI
Input / Output
USB
  • 2 USB 3.2 Gen1 port(s) (Header)
  • 3 USB 3.2 Gen2 Type-A port(s) (Rear)
  • 1 USB 3.2 Gen2x2 Type-C port(s) (Rear)
  • 2 USB 3.2 Gen2 Type-C port(s) (Rear)
  • 1 USB 2 port(s) (Header)
Video
  • 1 HDMI 2 port(s)
  • 1 Display Port port(s)
  • 2 VGA Type-C 3.2 Gen2 port(s) (Rear)
Serial
  • 1 COM port(s) (header)
Audio
  • ALC 888S HD Audio
TPM
  • 1 TPM 2.0 Header
Expansion Slots
PCI-Express (PCIe) Configuration
  • 1 PCIe 4.0 x4 slot
  • 2 PCIe 5.0 x16 slots
M2
  • 2 M.2 PCIe 5.0 x4 slots (M-key 2280/22110)
System BIOS
BIOS Type
  • AMI 32MB SPI Flash EEPROM
BIOS Features
  • ACPI 6.4
  • Plug and Play (PnP)
  • SMBIOS 3.5 or later
  • UEFI 2.8
  • USB Keyboard support
Management
Software
Power Configurations
  • Power-on mode control for AC power loss recovery
  • Power button override mechanism
  • S3/S4/S5
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
PC Health Monitoring
Voltage
  • +12V
  • +3.3V
  • +5V
  • +5V standby
  • 3.3V standby
  • CPU temperature
  • CPU thermal trip support
  • Memory temperature
  • PCH temperature
  • System temperature
FAN
  • 7x 4-pin fan headers (up to 7 fans)
Operating Environment
Environmental Spec.
  • Operating Temperature: 0°C to 50°C (32°F to 122°F )
  • Non-operating Temperature: -20°C to 60°C (-4°F to 140°F)
  • Operating Relative Humidity: 10% to 85% (non-condensing)
  • Non-operating Relative Humidity: 10% to 95% (non-condensing)
Resources
Parts List
Standard Parts (Bulk Package)
Part Number Qty Description
I/O Shield MCP-260-00185-0B 1 -
SATA Cables CBL-0044L 2 -
Standard Parts (Retail Package)
Part Number Qty Description
I/O Shield MCP-260-00185-0B 1 -
Quick Reference Guide MNL-2627-QRG 1 -
SATA Cables CBL-0044L 4 -
Optional Parts
Part Number Qty Description
1U I/O Shield MCP-260-00186-0N 1 -
TPM security module (optional, not included) AOM-TPM-9670H 1 SPI capable TPM 2.0 with Infineon 9670 controller with horizontal form factor
AOM-TPM-9670V 1 SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor
AOM-TPM-9671H 1 -
AOM-TPM-9671V 1 -

H13SAE-MF

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