X14DBG-LC (For SuperServer Only)

X14 GPU

Key Features


  1. Intel® Xeon® 6700/6500 series processors with P-cores or 6700 series processors with E-cores, Single Socket LGA-4710 (Socket E2) supported, CPU TDP supports Up to 350W TDP
  2. Support DDR5 RDIMM 5200MT/s in 32 DIMM slots (2DPC)
  3. Support DDR5 MRDIMM 8000MT/s in 16 DIMM slots (1DPC)
  4. M.2 Interface: 2 PCIe5.0 x4M.2 Form Factor: 2280, 22110M.2 Key: M-Key
  5. 4 MCIO Connectors PCIe 5.0 x8 (NVMe)
  6. 4 MCIO Connectors PCIe 5.0 x16 (Bluefield)
  7. Networking options provided via Intel X710 via. LOM
  8. Support Nvidia HGX Blackwell B200
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Specifications Resources
Specifications
Product SKUs
MBD-X14DBG-LC
Physical Stats
Form Factor
  • Proprietary
Dimension
  • 17" x 13.88"
Processor
CPU
System Memory
Memory
  • Slot Count: 32 DIMM Slots/16 Channels
  • Max Memory (1DPC): Up to 4TB 6400MT/s ECC DDR5 RDIMM
  • Max Memory (1DPC): Up to 4TB 8000MT/s ECC DDR5 MRDIMM
  • Max Memory (2DPC): Up to 8TB 5200MT/s ECC DDR5 RDIMM
DIMM Sizes
  • RDIMM:64GB, 96GB, 128GB, 256GB
  • MRDIMM:96GB, 128GB, 256GB
Memory Voltage
  • 1.1V
Error Detection
  • Corrects single-bit errors
  • Detects double-bit errors (using ECC memory)
Input / Output
TPM
  • 1 TPM 2.0 Header
Expansion Slots
PCI-Express (PCIe) Configuration
  • 13 PCIe 5.0 x8 (in x8) via MCIO Connector slots
M2
  • 2 M.2 PCIe 5.0 x2 NVMe slots (M-key 2280/22110)
System BIOS
BIOS Type
  • AMI 64MB UEFI
Management
Software
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
PC Health Monitoring
Voltage
  • +12V,+3.3V,+3.3V standby,+5V,+5V standby,ACPI power management,CPU temperature,CPU thermal trip support,Fan speed control,Memory temperature,Peripheral temperature,Platform Environment Control Interface (PECI)/(TSI),System temperature,Vcore,Vmem
LED
  • BMC/IPMI Heartbeat LED
Other Features
  • Control of power-on for recovery from AC power loss
  • CPU thermal trip support
Resources
Parts List

X14DBG-LC (For SuperServer Only) Coming Soon

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