X14SBT-GAP

X14SBT-GAP
X14 UP GrandTwin Server Board

Key Features


  1. Intel® Xeon® 6900-series processors with P-cores, Single Socket LGA-7529 (Socket BR) supported, CPU TDP supports Up to 500W TDP
  2. 12 DIMM slots supporting up to 3TB
  3. 1 PCIe 5.0 x8 via customized 124-pin slim cool edge connector(for front I/O module)
  4. 8 PCIe 5.0 x8 via MCIO connectors to support AIOM, storage devices or PCIe expansion slots
  5. I/O: 1 COM, TPM header
  6. 1 PCIe 5.0 x8 GENZ 2C connector to support 2x M.2 (2280,22110) via proprietary M.2 adapter
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Optimized Servers


SYS-212GT-DNAF
Specifications Resources Parts List
Specifications
Product SKUs
MBD-X14SBT-GAP
Physical Stats
Form Factor
  • Proprietary
Dimension
  • 8.53" x 12.42" (21.67cm x 31.55cm)
Processor
CPU
Core Count
  • Up to 128C
Note
  • Supports up to 500W TDP CPUs
System Memory
Memory
  • Slot Count: 12 DIMM Slots
  • Max Memory (1DPC): Up to 3TB 8800MT/s ECC DDR5 MRDIMM
  • Max Memory (1DPC): Up to 3TB 6400MT/s ECC DDR5 RDIMM
DIMM Sizes
  • MRDIMM:32GB, 48GB, 64GB, 96GB, 128GB, 256GB
  • RDIMM:32GB, 48GB, 64GB, 96GB, 128GB, 256GB
Memory Voltage
  • 1.1V
Error Detection
  • Corrects single-bit errors
  • Detects double-bit errors (using ECC memory)
On-Board Devices
Chipset
  • System on Chip
IPMI
  • ASPEED AST2600 BMC
Input / Output
Video
  • 1 Aspeed AST2600 BMC port(s)
Serial
  • 1 COM port(s) (header)
TPM
  • 1 TPM header
Expansion Slots
PCI-Express (PCIe) Configuration
  • 8 PCIe 5.0 x8 via MCIO Connector slots
  • 1 PCIe 5.0 x8 slot
  • 1 PCIe 5.0 x8 slot
M2
  • 2 M.2 PCIe 5.0 x8 slots (M-key 2280/22110; M.2 support requires an optional M.2 adapter card)
System BIOS
BIOS Type
  • AMI 64MB UEFI
BIOS Features
  • ACPI 6.5
  • SMBIOS 3.7 or later
  • UEFI 2.9
Management
Software
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
PC Health Monitoring
Voltage
  • +12V
  • +3.3V
  • +5V
  • +5V standby
  • Monitors CPU voltages
  • Supports system management utility
  • System level control
  • VBAT
LED
  • CPU/system overheat LED
  • UID/remote UID LED
Temperature
  • CPU thermal trip support
  • Monitoring for CPU and chassis environment
  • PECI
  • Thermal monitor 2 (TM2) support
FAN
  • Fan speed control
Other Features
  • ACPI power management
  • Control of power-on for recovery from AC power loss
  • M.2 NGFF connector
  • UID
  • WOL
Operating Environment
Environmental Spec.
  • Operating Temperature: 0°C to 50°C (32°F to 122°F )
  • Non-operating Temperature: -30°C to 60°C (-22°F to 140°F)
  • Operating Relative Humidity: 8% to 80% (non-condensing)
  • Non-operating Relative Humidity: 8% to 90% (non-condensing)
Resources
Servers (Optimized for X14SBT-GAP)
SYS-212GT-DNAF
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Component Options
Tested AOC List
Tested HDD / SSD List
Tested M.2 List
Tested Memory List
Software
BMC Firmware
Download Driver CD
Download the Latest Drivers and Utilities
OS Compatibility
Update Your BIOS
Documentation
Motherboard Manual
Quick Reference Guide
Parts List
Optional Parts
Part Number Qty Description
CPU carrier SKT-1554H-BK00-FXC 1 BR1A CPU carrier for Intel® Xeon® 6 processors (UCC)
TPM security module (optional, not included) AOM-TPM-9672V 1 SPI capable TPM 2.0 with Infineon 9672 controller in vertical form factor

X14SBT-GAP New

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  2. Motherboards
  3. X14SBT-GAP

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