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Overview

Highlights

  • Maximum throughput and density for performance-intensive storage applications
  • Enhanced support for EDSFF E3.S form factor drives
  • Ultra-high density - up to 960TB in 1U or 1.92PB in 2U

Innovations

  • Symmetrical dual processor architecture shortens data paths to reduce latency
  • Supports up 8 CXL 2.0 devices for increased shared memory pool
  • New support for the OCP Data Center Modular Hardware System (DC-MHS)

Optimized for:

  • Enterprise Applications
  • Data Center
  • Hyperscale / Hyperconverged
  • Software-defined Storage
  • Data Warehousing

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