X13DEI

X13DEI
X13 DP Mainstream Server Board

Key Features


  1. 2 SATA DOM ports
  2. 2 M.2
  3. 6 NVMe ports PCIe 5.0 x4 via 3 MCIO connectors
  4. 8 SATA3.0 ports
  5. 5th/4th Gen Intel® Xeon® Scalable processors, Dual Socket LGA-4677 (Socket E) , CPU TDP supports up to 350W TDP
  6. Supports CXL
  7. Intel® C741 Chipset
  8. Up to 4TB 3DS ECC RDIMM, DDR5-5600MT/s in 16 DIMM slots
  9. 4 PCIe 5.0 x16
  10. 2 PCIe 5.0 x8
  11. Broadcom BCM5720 Dual ports 1G LAN
  12. 6 USB3.0 and 3 USB2.0
...
...

Optimized Servers


SYS-621P-TR SYS-741P-TR SYS-221P-C9R
Specifications Resources Parts List
Specifications
Product SKUs
MBD-X13DEI
Physical Stats
Form Factor
  • E-ATX
Dimension
  • 12.1" x 13.05" (30.74cm x 33.15cm)
Processor
CPU
Core
  • Up to 64 cores
System Memory
Memory Capacity
  • 16 DIMM slots
  • Up to 4TB 3DS ECC RDIMM, DDR5-5600MT/s
  • **24GB & 48GB DIMM only support 1 DPC.
  • *24GB/48GB/96GB DDR5 DIMMs with 24Gb chip are only supported by 5th and 4th XCC Gen Intel® Xeon-SP CPU.
Memory Type
  • 5600/5200/4800/4400/4000 MT/s ECC DDR5 RDIMM (3DS) Up to 256GB of memory with speeds of up to 5600MT/s(1DPC)
DIMM Sizes
  • 16GB, 24GB, 32GB, 48GB, 64GB, 96GB, 128GB, 256GB
  • RDIMM: Up to 256GB
Memory Voltage
  • 1.1V
Error Detection
  • Corrects single-bit errors
  • Detects double-bit errors (using ECC memory)
On-Board Devices
SATA
  • Intel® C741 controller for 8 SATA ports; RAID 0/1/5/10
  • Intel® C741 controller for 2 SATA ports; RAID 0/1
IPMI
  • ASPEED AST2600 BMC
Network Controllers
  • Dual LAN with Broadcom BCM5720 1GBase-T
Input / Output
LAN
  • 1 RJ45
Serial Port
  • 1 COM
  • 1 COM
DOM
  • 2 SATA DOM (Disk on Module) portwith power connector support
Others
  • 3 MCIO
Expansion Slots
PCIe
  • 2 PCIe 5.0 x8,
  • 4 PCIe 5.0 x16
M.2
  • M.2 Interface: 2 PCIe 4.0
  • Form Factor: 2280/22110
  • Key: M-key
System BIOS
BIOS Type
  • AMI 32MB UEFI
  • AMI 32MB UEFI
  • AMI 32MB UEFI
  • AMI 32MB UEFI
  • AMI 32MB UEFI
BIOS Features
  • SMBIOS 2.8/3.5
Management
Software
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
PC Health Monitoring
Voltage
  • System temperature, PCH temperature, Memory temperature, CPU temperature, +5V standby, +5V, +3.3V, +12V, CPU thermal trip support, +3.3V standby, Veore, Vmem, Peripheral temperature, Platform Environment Control Interface (PECI)/(TSI)
LED
  • UID/remote UID LED
  • CPU/system overheat LED
Temperature
  • Monitoring for CPU and chassis environment
  • CPU thermal trip support
  • Thermal monitor 2 (TM2) support
  • PECI
FAN
  • 8x 4-pin fan headers (up to 8 fans)
  • Fan speed control
  • Overheat LED indication
  • 8 fans with tachometer monitoring
Other Features
  • UID, Node manager support, M.2 NGFF connector, Control of power-on for recovery from AC power loss, Chassis intrusion detection, ACPI power management
Operating Environment
Operating Temperature Range
  • 10°C - 35°C (50°F - 95°F)
Non-Operating Temperature Range
  • -40°C - 70°C (-40°F - 158°F)
Operating Relative Humidity Range
  • 8% - 90% (non-condensing)
Non Operating Relative Humidity Range
  • 5% - 95% (non-condensing)
Publish Status
0
  • Published
Resources
Servers (Optimized for X13DEI)
SYS-621P-TR
SYS-741P-TR
SYS-221P-C9R
...
Component Options
CPU-Liste
Geprüfte AOC-Liste
Liste der getesteten HDDs/SSDs
Geprüfte M.2 Liste
Getestete Speicherliste
Software
BMC-Firmware
Treiber-CD herunterladen
Laden Sie die neuesten Treiber und Dienstprogramme herunter
OS-Kompatibilität
Aktualisieren Sie Ihr BIOS
Documentation
Motherboard-Handbuch
Kurzreferenz
Parts List

X13DEI

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