Supermicro 編輯部

SAN JOSE, Calif. --August 11, 2026 (BUSINESS WIRE) -- Super Micro Computer, Inc.

• 12-session virtual event explores AI inference, agentic AI, cloud storage, and data management for production AI deployments
• 38 industry experts from 21 leading technology companies including AMD, DDN, Hammerspace, IBM, Intel, KIOXIA, MinIO, Nutanix, Scality, Solidigm, VAST Data, Western Digital, Crusoe, Iron Mountain and others, share practical guidance for scalable, cost-efficient AI infrastructure
• Presented with theCUBE, the summit runs August 11 through September 3 and is available live and on demand

• Industry-leading quality, factory pre-assembly, and modular design facilitate rapid integration of systems and liquid cooling components, shortening Time-to-Online (TTO)
• Ten Rack models available in 44OU, 48U, 48OU, and 52U configurations for same-day data center integration to support a wide range of deployments
• Certified for up to over 5500 lb./2,500 kg static load capacity to maximize compute power per rack, enabling higher compute densities and optimal space utilization

• 33% more cores, 2X PCIe Bandwidth and 2.6X higher memory bandwidth supercharge high-performance workloads
• Powered by 6th Gen AMD EPYC CPUs and AMD Instinct™ GPUs, comprehensive rack-scale systems, built on DCBBS architecture, are optimized for Cloud, Enterprise, Storage, HPC and AI workloads
• Industry’s broadest portfolio also includes the 72-GPU AMD Helios Platform, designed for large-scale AI training and high-throughput inference

• Expanded ten-model portfolio supports cooling chill door capacities from 10kW up to 120kW for systems level to rack-scale AI factories
• Flexible Rear Door Heat Exchangers deliver rapid, low-disruption liquid cooling for both new and legacy data centers
• Integrated DCBBS deliver validated rack-scale infrastructure, intelligent management software, and global deployment services