New Supermicro Systems Enable Customers to Upgrade and Consolidate Data Centers for AI Workloads

全新 3U 伺服器最多可支援 18 繪圖處理器，並配備採用 P 核心的 Intel® Xeon® 6900 系列雙處理器

Designed for Data Center Scale Reduction in TCO and Enabling Large AI Clusters to Perform with a Lower Energy Budget, Liquid Cooling Solution Handles the Highest Wattage Servers Containing the Latest NVIDIA GPUs and CPUs, Resulting in Lower Costs for AI Factories – Over 2,000 Liquid Cooled Racks Delivered Since June 2024

為研發用於下一代系統，支援企業內部和雲端資料中心的 Gen AI 和 HPC 工作負載，並推廣綠色 IT，兩大公司結合工程與設計專業知識

超過15個經過全面升級的伺服器產品系列，專為實現最高效能或效率而最佳化，並支援新一代GPU、更高頻寬的記憶體、400GbE網路、E1.S與E3.S 硬碟，以及直達晶片液冷（Direct-to-Chip，D2C）技術，且可搭載具有效能核心（P-Core）的全新Intel® Xeon® 6900系列處理器和效率核心（E-Core）的Intel Xeon 6700系列處理器

The New Rack-Scale Ready FlexTwin™ Systems Deliver Unprecedented Compute-Density in a Multi-Node Form Factor, with DLC dual CPUs up to 500W Each per Node, Front Node Access and Optimized Networking

A Complete Architecture Upgrade that Includes New Performance-Optimized CPUs, Next-Generation GPU support, Upgraded Memory MRDIMMs, 400GbE Networking, New Storage Options Including E1.S and E3.S drives, and Direct-to-Chip Liquid Cooling, based on the Upcoming Intel® Xeon® 6900 Series Processors with P-Cores (formerly codenamed Granite Rapids-AP) Supporting Demanding Workloads

5th Annual Summit Features 7 Sessions with 17 Leading Storage Technology Partners and 30 speakers to Discuss Best Practices and New Developments in Storage for AI, CSP, HPC, HCI and many other Workloads

Supermicro Rack Solution Features up to 256 of the Most Advanced NVIDIA PCIe GPUs in One Scalable Unit to Maximize Performance for 3D & AI Workloads, Optimized for NVIDIA Omniverse Large-Scale Deployments

Expanded Manufacturing Footprint is Targeted to Bring Global Liquid- Cooled Rack Capacity to More than Double Today's 1,000 AI SuperClusters Shipped Per Month