概覽
X14/H14 2U4N FlexTwin™ with Liquid Cooling
Purpose-built HPC-at-scale solution
- CPU: Dual Intel Xeon 6900 series processors with P-cores or AMD EPYC™ 9005/9004 series processors per node
- Memory: Up to 24 DIMMs per node, 9TB DDR5 or 3TB MRDIMM
- Drives: Up to 2 front hot-swap E1.S PCIe 5.0 NVMe drive bays per node
- PCIe: 1 PCIe 5.0 x16 (LP) + 1 PCIe 5.0 x16 (FHHL) + 1 PCIe 5.0 x16 AIOM per node
X14 1OU FlexTwin™ with Liquid Cooling
Purpose-built HPC-at-scale solution based on the Open Rack architecture
- CPU: Dual Intel® Xeon® 6900 Series Processors per node
- Memory: Up to 24 DIMMs per node, 6TB DDR5
- Drives: Up to 2x hot-swap E1.S NVMe per node
- PCIe: 1x PCIe 5.0 x16 AIOM per node
資源
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Supermicro ：全新FlexTwin™ HPC 解決方案
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TECHTalk：Supermicro 全新X14 多節點系統
