B14SBE-CPU-25G

X14 UP SuperBlade Server Board

Key Features


  1. Intel® Xeon® 6700/6500-series processors with P-cores or E-cores, Single Socket LGA-4710 (Socket E2) supported, CPU TDP supports Up to 350W TDP
  2. Up to 2TB DDR5 ECC RDIMM or 4TB RDIMM (3DS) with speeds of up to 6400MT/s (1DPC) or DDR5-5200MT/s (2DPC) or up to 512GB MRDIMM (1DPC) DDR5-8000MT/s in 16 DIMM slots
  3. 5x PCIe 5.0 x8 MCIO connectors for GPU Riser/NVMe/AIOM add on module
  4. Onboard Intel® Columbiaville Ethernet Controller E810-XXVAM2
  5. M.2 Interface: 1x PCIe 5.0 x4 M.2 Form Factor: 2280, 22110M.2 Key: M-Key
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Optimized Servers


Specifications Resources Parts List
Specifications
Product SKUs
MBD-B14SBE-CPU-25G
Physical Stats
Form Factor
  • Proprietary
Dimension
  • 12.1" x 9.36" (30.74cm x 23.77cm)
Processor
CPU
Core Count
  • Up to 144C
Note
  • Supports up to 350W TDP CPUs
System Memory
Memory
  • Slot Count: 16 DIMM Slots
  • Max Memory (1DPC): Up to 2TB 6400MT/s ECC DDR5 RDIMM
  • Max Memory (1DPC): Up to 512GB 8000MT/s ECC DDR5 MRDIMM (P-core only)
  • Max Memory (1DPC): Up to 4TB 6400MT/s ECC DDR5 3DS RDIMM
  • Max Memory (2DPC): Up to 2TB 5200MT/s ECC DDR5 RDIMM
  • Max Memory (2DPC): Up to 4TB 5200MT/s ECC DDR5 3DS RDIMM
DIMM Sizes
  • 3DS RDIMM:256GB
  • MRDIMM (P-core only):32GB, 64GB
  • RDIMM:16GB, 24GB, 32GB, 48GB, 64GB, 96GB, 128GB
Memory Voltage
  • 1.1V
Error Detection
  • Corrects single-bit errors
  • Detects double-bit errors (using ECC memory)
On-Board Devices
Chipset
  • System on Chip
IPMI
  • ASPEED AST2600 BMC
Network Controller
  • Dual LAN with Intel® Ethernet Controller E810-XXVAM2, Two (2) 25GbE Ethernet ports from KR interface to BP
Input / Output
TPM
  • 1 TPM 2.0 Header
  • 1 TPM chip onboard
Expansion Slots
PCI-Express (PCIe) Configuration
  • 1 PCIe 4.0 x16 via Mezzanine Card Connector slot
  • 1 PCIe 4.0 x16 SIOM slot
  • 5 PCIe 5.0 x8 via MCIO Connector slots , For GPU Riser/NVMe/AIOM add on module
M2
  • 1 M.2 PCIe 5.0 x4 slot (M-key 2280/22110)
System BIOS
BIOS Type
  • AMI 64MB UEFI
BIOS Features
  • ACPI 6.5
  • SMBIOS 3.7 or later
  • UEFI 2.9
Management
Software
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
PC Health Monitoring
Voltage
  • +12V
  • +3.3V
  • +5V
  • +5V standby
  • GPUtemperature
  • Monitors CPU voltages
  • Supports system management utility
  • System level control
  • VBAT
LED
  • CPU/system overheat LED
  • UID/remote UID LED
Temperature
  • CPU thermal trip support
  • Monitoring for CPU and chassis environment
  • PECI
  • Thermal monitor 2 (TM2) support
FAN
  • Fan speed control
Other Features
  • ACPI power management
  • Control of power-on for recovery from AC power loss
  • UID
Operating Environment
Environmental Spec.
  • Operating Temperature: 10°C to 35°C (50°F to 95°F )
  • Non-operating Temperature: -30°C to 60°C (-22°F to 140°F)
  • Operating Relative Humidity: 8% to 80% (non-condensing)
  • Non-operating Relative Humidity: 8% to 90% (non-condensing)
Resources
Parts List
Optional Parts
Part Number Qty Description
CPU carrier SKT-1543H-0000-FXC 1 CPU carrier for Intel® Xeon® 6 processors (XCC)
SKT-1544H-0000-FXC 1 CPU carrier for Intel® Xeon® 6 processors (HCC/LCC)
QRG QRG-2684 1 Motherboard Quick Reference Guide

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