H14DSG-O-CPU

H14 DP GPU Server Board

Key Features


  1. Dual AMD EPYC™ 9005/9004 Series Processors
  2. Up to 6400MT/s ECC DDR5 RDIMM memory
  3. 20 PCIe 5.0 x8 MCIO connectors
  4. 2 SATA3, 1AIOM slot
  5. M.2 Interface: 1 PCIe 3.0 x4 (2280, 22110)
  6. 2 USB 3.0 via I/O board
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Optimized Servers


Specifications Resources Parts List
Specifications
Product SKUs
MBD-H14DSG-O-CPU
Physical Stats
Form Factor
  • Proprietary
Dimension
  • 17" x 14.95" (43.18cm x 37.97cm)
Processor
CPU
Core Count
  • Up to 384C/768T
Note
  • Supports up to 500W TDP CPUs
System Memory
Memory
  • Slot Count: 24 DIMM Slots
  • Max Memory (1DPC): Up to 6TB 6400MT/s ECC DDR5 RDIMM (AMD EPYC™ 9005 Series Processor)
  • Max Memory (1DPC): Up to 6TB 4800MT/s ECC DDR5 RDIMM (AMD EPYC™ 9004 Series Processor)
Memory Voltage
  • 1.1V
Error Detection
  • Corrects single-bit errors
  • Detects double-bit errors (using ECC memory)
On-Board Devices
SATA
  • SATA (6Gbps) via Asmedia ASM1061; via SlimSAS
Input / Output
LAN
  • 1 RJ45 Dedicated IPMI LAN port(s)
USB
  • 2 USB 2 port(s) (Header)
Video
  • 1 Aspeed AST2600 BMC port(s)
TPM
  • 1 TPM header
Others
  • 20 MCIO (PCIe 5.0 x8) port(s)
Expansion Slots
PCI-Express (PCIe) Configuration
  • 1 PCIe 5.0 x16 AIOM Networking slot
M2
  • 1 M.2 PCIe 3.0 x4 slot (M-key 2280/22110)
System BIOS
BIOS Type
  • AMI 64MB SPI Flash EEPROM
BIOS Features
  • UEFI 2.8
  • ACPI 6.5
  • SMBIOS 3.7 or later
Management
Software
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
PC Health Monitoring
Voltage
  • +12V
  • +3.3V
  • +5V
  • +5V standby
  • 3.3V standby
  • CPU temperature
  • CPU thermal trip support
  • Memory temperature
  • System temperature
LED
  • BMC/IPMI Heartbeat LED
  • CPU/system overheat LED
  • Fanfailed LED
  • Power LED
  • UID/remote UID LED
FAN
  • 6x 8-pin fan headers (up to 6 fans)
Operating Environment
Environmental Spec.
  • Operating Temperature: 10°C to 35°C (50°F to 95°F )
  • Non-operating Temperature: -40°C to 70°C (-40°F to 158°F)
  • Operating Relative Humidity: 8% to 90% (non-condensing)
  • Non-operating Relative Humidity: 5% to 95% (non-condensing)
Resources
Parts List
Optional Parts
Part Number Qty Description
TPM security module (optional, not included) AOM-TPM-9670V 1 SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor
AOM-TPM-9671V 1 SPI capable TPM 1.2 with Infineon 9670 controller with vertical form factor

H14DSG-O-CPU

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