2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s
Intel® C621
Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots; Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)
1 PCIe 3.0 x32 Left Riser Slot, 1 PCIe 3.0 x16 Right Riser Slot, 1 PCIe 3.0 x16 for Add-On-Module (AOM) M.2 Interface: PCIe 3.0 x4 M.2 Form Factor: 2242, 2260, 2280, 22110 M.2 Key: M-Key
UID, RoHS, Node manager support, CPU thermal trip support for processor protection, Control of power-on for recovery from AC power loss, Chassis intrusion detection
SPI capable TPM 2.0 with Infineon 9670 controller with horizontal form factor SPI capable TPM 1.2 with Infineon 9671 controller with horizontal form factor
