X11SDC-8C

COM-HPC Server
Skylake-D
Carrier Board ODM
OEM only

Key Features

Intel® Xeon® Processor D-2146NT, 8-Core, 16 Threads, 80W
Up to 256GB Registered ECC RDIMM or 512GB ECC LRDIMM, DDR4-2400MHz in 4 DIMM slots
Up to 44 PCIe Gen3 lanes (x16, x8, x4, x1) to Carrier Board
Quad 10G BASE-KR ports (SoC) to Carrier Board
Single 1G BASE-T port (Intel i210IT) to Carrier Board
System on Chip

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Specifications

Product SKUs
MBD-X11SDC-8C

Physical Stats
Form Factor	COM-HPC
Dimension	6.3" x 6.3" (16cm x 16cm)

Processor
CPU	Intel® Xeon® Processor D-2146NT
Core	Up to 8 cores, 16 threads / 11MB Cache

System Memory
Memory Capacity	4 DIMM slots Up to 512GB ECC LRDIMM, DDR4-2400MT/s; Up to 256GB ECC RDIMM, DDR4-2400MT/s
Memory Type	ECC DDR4 LRDIMM, RDIMM 2400
DIMM Sizes	LRDIMM: 16GB, 32GB, 64GB, 128GB RDIMM: 4GB, 8GB, 16GB, 32GB, 64GB
Memory Voltage	1.2V
Error Detection	Corrects single-bit errors Detects double-bit errors (using ECC memory)

On-Board Devices
Chipset	System on Chip
Network Controllers	Quad LAN with 10GBase-KR ports (SoC) to Carrier Board Single LAN with 1GBase-T port (Intel® i210-IT) to Carrier Board

Input / Output
TPM	1 TPM Header

Expansion Slots
PCIe	Up to 44 PCIe Gen3 lanes (x16, x8, x4, x1) to Carrier Board

System BIOS
BIOS Type	AMI UEFI
BIOS Features	ACPI 6.2 UEFI 2.7 SMBIOS 2.8 SMBIOS 3.1 PCI FW 3.2 Plug and Play (PnP)

Operating Environment
Operating Temperature Range	0°C - 60°C (32°F - 140°F)
Operating Relative Humidity Range	8% - 90% (non-condensing)
Non Operating Relative Humidity Range	5% - 95% (non-condensing)

Publish Status
0	Published

Resources

Component Options

Software

Documentation

Parts List

X11SDC-8C

Products
Motherboards
X11SDC-8C