X11SPL-F

Key Features

1. 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, Single Socket LGA-3647 (Socket P) supported, CPU TDP supports Up to 165W TDP
2. Intel® C621 Chipset
3. Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots;
   Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)
4. Expansion slots:
   2 PCIe 3.0 x8 (in x16),
   4 PCIe 3.0 x8,
   1 PCIe 3.0 x4 (in x8)
5. M.2 NGFF connector
   M.2 Interface: PCIe 3.0 x4 and SATA
   Form Factor: 2280, 22110
   Key: M-Key
6. 2 GbE LAN ports
7. 8 SATA3 (6Gbps) ports
8. I/O: 1 VGA, 2 COM, TPM header
9. 2 SuperDOM with built-in power
10. 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 8 USB 2.0 (2 rear, 6 via headers)

Optimized Servers