X13DEI

X13 Mainstream

Key Features


  1. Support CXL
  2. 5th/4th Gen Intel® Xeon® Scalable processors, Dual Socket LGA-4677 (Socket E) , CPU TDP supports up to 350W TDP
  3. Intel® C741 Chipset
  4. Up to 4TB 3DS ECC RDIMM, DDR5-5600MT/s in 16 DIMM slots
  5. 4 PCIe 5.0 x16
  6. 2 PCIe 5.0 x8
  7. Broadcom BCM5720 Dual ports 1G LAN
  8. 6 USB3.0 and 3 USB2.0
  9. 2 SATA DOM ports
  10. 2 M.2
  11. 6 NVMe ports PCIe 5.0 x4 via 3 MCIO connectors
  12. 8 SATA3.0 ports
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Optimized Servers


Specifications Resources Parts List
Specifications
Product SKUs
MBD-X13DEI
Physical Stats
Form Factor
  • EATX
Dimension
  • 12.1" x 13.05" (30.74cm x 33.15cm)
Processor
CPU
Core
  • Up to 64 cores
System Memory
Memory Capacity
  • 16 DIMM slots
  • Up to 4TB 3DS ECC RDIMM, DDR5-5600MHz
Memory Type
  • 5600/5200/4800/4400/4000 MT/s ECC DDR5 RDIMM (3DS) Up to 256GB of memory with speeds of up to 5600MT/s(1DPC)
DIMM Sizes
  • 16GB, 32GB, 64GB, 96(XCC Only)GB, 128GB, 256GB
  • RDIMM: Up to 256GB
Memory Voltage
  • 1.1V
Error Detection
  • Corrects single-bit errors
  • Detects double-bit errors (using ECC memory)
On-Board Devices
Chipset
  • Intel® C741
SATA
  • Intel® C741 controller for 8 SATA3 (6 Gbps) ports; RAID 0,1,5,10
  • Intel® C741 controller for 2 SATA3 (6 Gbps) ports; RAID 0,1
IPMI
  • ASPEED AST2600 BMC
Network Controllers
  • Dual LAN
  • Dual LAN with Broadcom BCM5720 1GBase-T
Input / Output
SATA
  • 8 SATA3 (6Gbps) port(s)
  • 2 SATA3 (6Gbps) port(s)
LAN
  • 1 RJ45 Dedicated IPMI LAN port
USB
  • 6 USB 3 port(s) (2 via header; 4 rear)
  • 3 USB 2 port(s) (2 via header; 1 Type A)
Video Output
  • 1 VGA D-Sub Connector port(s)
Serial Port
  • 2 COM Port(s) (1 header; 1 rear)
TPM
  • 1 TPM Header
Others
  • 3 MCIO PCIe 5.0 x8
Expansion Slots
PCIe
  • 2 PCIe 5.0 x8,
  • 4 PCIe 5.0 x16
M.2
  • M.2 Interface: 2 PCIe 4.0 x2
  • Form Factor: 2280/22110
  • Key: M-Key
System BIOS
BIOS Type
  • AMI 32MB AMI UEFI
BIOS Features
  • ACPI 6.4
  • SMBIOS 2.8/3.5
  • UEFI 2.8A
  • Plug and Play (PnP)
  • PCI FW 3.2
Management
Software
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
PC Health Monitoring
Voltage
  • System temperature, PCH temperature, Memory temperature, CPU temperature, +5V standby, +5V, +3.3V, +12V, CPU thermal trip support, +3.3V standby, Veore, Vmem, Peripheral temperature, Platform Environment Control Interface (PECI)/(TSI)
LED
  • UID/Remote UID
  • CPU / System Overheat LED
Temperature
  • Monitoring for CPU and chassis environment
  • CPU thermal trip support
  • Thermal Monitor 2 (TM2) support
  • PECI
FAN
  • 8x 4-pin fan headers (up to 8 fans)
  • Fan speed control
  • Overheat LED indication
  • 8x fans with tachometer monitoring
Other Features
  • UID, Node Manager Support, M.2 NGFF connector, Control of power-on for recovery from AC power loss, Chassis intrusion detection, ACPI power management
Operating Environment
Operating Temperature Range
  • 10°C - 35°C (50°F - 95°F)
Non-Operating Temperature Range
  • -40°C - 70°C (-40°F - 158°F)
Operating Relative Humidity Range
  • 8% - 90% (non-condensing)
Non Operating Relative Humidity Range
  • 5% - 95% (non-condensing)
Resources
Parts List
X13DEI