X13DET-B

X13 DP BigTwin Server Board

Key Features


  1. 5th/4th Gen Intel® Xeon® Scalable processors, Dual Socket LGA-4677 (Socket E) , CPU TDP supports up to 350W TDP
  2. Supports CXL 1.0, 1.1
  3. Intel C741® Chipset
  4. Up to 4TB 3DS ECC RDIMM, DDR5-5600MT/s in 16 DIMM slots
  5. 2 PCIe 5.0 x16 slots supported by CPU1 (Slot1, Slot2)
  6. 1 PCIe 5.0 x16 slots supported by CPU2 (SXB1) for NVMe, SATA, SAS storage card(s)
  7. 1 PCIe 5.0 x8 for 2 NVMe M.2 connections on AOC supported by CPU1 (SXB5)
  8. 2 PCIe 5.0 x8 slots supported by CPU1 (SXB3, SXB4) for SAS 3.0, NVMe storage card(s)
  9. 3 PCIe 5.0 x8 connector supported by CPU1 and CPU2 (NS1, NS2, NS3) for NVMe storage card(s)
  10. 2 SATA headers support 12 SATA 3.0 connections
  11. UID/BMC Reset Switch and UID_LED/BMC LED Indicator
  12. Support for TPM (JTPM1)
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Optimized Servers


Specifications Resources Parts List
Specifications
Product SKUs
MBD-X13DET-B
Physical Stats
Form Factor
  • Proprietary
Dimension
  • 7.62" x 18.8" (19.36cm x 47.75cm)
Processor
CPU
Core Count
  • Up to 64C
Note
  • Supports up to 350W TDP CPUs
System Memory
Memory
  • Slot Count: 16 DIMM Slots
  • Max Memory (1DPC): Up to 4TB 5600MT/s ECC DDR5 RDIMM
DIMM Sizes
  • RDIMM:16GB, 32GB, 64GB, 96GB, 128GB, 256GB
Memory Voltage
  • 1.1V
Error Detection
  • Corrects single-bit errors
  • Detects double-bit errors (using ECC memory)
On-Board Devices
Chipset
  • Intel® C741
SATA
  • SATA (6Gbps) via Intel® C741; via SlimSAS
  • SATA (6Gbps) via Intel® C741; via SlimSAS
Network Controller
  • AIOM for LAN
Input / Output
USB
  • 2 USB 3.2 Gen1 Type-A port(s) (rear)
Video
  • 1 VGA D-Sub Connector port(s)
Serial
  • 1 COM port(s) (header)
TPM
  • 1 TPM header
Others
  • 1 AIOM port(s)
Expansion Slots
PCI-Express (PCIe) Configuration
  • 1 PCIe 5.0 x16 Left Riser slot
  • 1 PCIe 5.0 x16 Right Riser slot
  • 1 PCIe 5.0 x8 slot
  • 2 PCIe 5.0 x8 slots
  • 3 PCIe 5.0 x8 slots , NS-HD connector
  • 1 PCIe 5.0 x16 AIOM Networking slot
M2
  • 2 M.2 PCIe 3.0 x4 slots (M-key 2280/22110; SXB5 supports 2 M.2 devices in 22110 form factor with 2 PCIe 4.0 x4, or 2 M.2 devices in 2280 with 2 PCIe 3.0 x4)
System BIOS
BIOS Type
  • AMI 32MB UEFI
BIOS Features
  • Plug and Play (PnP)
  • PCI FW 3.2
  • ACPI 6.4
  • UEFI 2.8A
  • SMBIOS 2.8/3.5
Management
Software
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
PC Health Monitoring
Voltage
  • +12V
  • +12V Standby
  • +3.3V
  • +5V
  • 2 fans with tachometer status monitoring
  • Monitors CPU voltages
  • Supports system management utility
  • System level control
  • VBAT
FAN
  • 2x 4-pin fan headers (up to 2 fans)
  • Node manager support
Other Features
  • ACPI power management
  • Chipset voltage
  • Control of power-on for recovery from AC power loss
  • CPU thermal trip support
  • CPU/system overheat LED
  • M.2 NGFF connector
  • Monitoring for CPU and chassis environment
  • PECI
  • Temperature of CPU, PCH, System, DIMM, Peripheral
  • UID
  • UID/remote UID LED
Operating Environment
Environmental Spec.
  • Operating Temperature: 10°C to 35°C (50°F to 95°F )
  • Non-operating Temperature: -40°C to 70°C (-40°F to 158°F)
  • Operating Relative Humidity: 8% to 90% (non-condensing)
  • Non-operating Relative Humidity: 5% to 95% (non-condensing)
Resources
Parts List
Standard Parts (Bulk Package)
Part Number Qty Description
CPU carrier SKT-1333L-0000-FXC 2 CPU carrier for 4th Gen Intel® Xeon® Scalable processors (XCC)
SKT-1333L-0000-FXC 2 CPU carrier for 4th Gen Intel® Xeon® Scalable processors Max Series (HBM)
SKT-1424L-001B-FXC 2 CPU carrier for 4th Gen Intel® Xeon® Scalable processors (MCC)
Optional Parts
Part Number Qty Description
TPM security module (optional, not included) AOM-TPM-9670H 1 SPI capable TPM 2.0 with Infineon 9670 controller with horizontal form factor

X13DET-B

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