X13OEI-CPU

X13 MP Server Board

Key Features


  1. 4th Gen Intel® Xeon® Scalable processors, Dual Sockets LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP (4 CPU module in one 8 Way System)
  2. Intel C741® Chipset (On PCH Module)
  3. Up to 8TB 3DS RDIMM/RDIMM DDR5 (288-pin) ECC memory with speeds up to 4800MHs (max.) in 32 DIMMs. Up to 8TB PMem 300 Series Memory
  4. PCI Slot Located on PCIe Module
  5. USB & Display Port on PCH Module
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Optimized Servers


Specifications Resources
Specifications
Product SKUs
MBD-X13OEI-CPU
Physical Stats
Form Factor
  • Proprietary
Dimension
  • 10.11" x 16.79" (256.79cm x 426.47cm)
Processor
CPU
Core Count
  • Up to 64C
Note
  • Supports up to 350W TDP CPUs
System Memory
Memory
  • Slot Count: 32 DIMM Slots
  • Max Memory (2DPC): Up to 32TB 4800MT/s ECC DDR5 RDIMM
DIMM Sizes
  • RDIMM:16GB, 32GB, 64GB, 128GB, 256GB
Memory Voltage
  • 1.1V
Error Detection
  • Corrects single-bit errors
  • Detects double-bit errors (using ECC memory)
On-Board Devices
Chipset
  • Intel® C741
System BIOS
BIOS Type
  • AMI 64MB UEFI
BIOS Features
  • ACPI 6.4; SMBIOS 2.8/3.5; UEFI 2.8A; Plug and Play (PnP); PCI FW 3.2
Management
Software
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
PC Health Monitoring
Voltage
  • CPU temperature
  • Fan speed control
  • Memory temperature
  • PCH temperature
  • Peripheral temperature
  • Platform Environment Control Interface (PECI)/(TSI)
FAN
  • 10x 4-pin fan headers (up to 10 fans)
Operating Environment
Environmental Spec.
  • Operating Temperature: 10°C to 35°C (50°F to 95°F )
  • Non-operating Temperature: -40°C to 70°C (-40°F to 158°F)
  • Operating Relative Humidity: 8% to 90% (non-condensing)
  • Non-operating Relative Humidity: 5% to 95% (non-condensing)
Resources
Parts List

X13OEI-CPU

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