X13SEFR-A

X13 UP FatTwin Server Board

Key Features


  1. 5th/4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP
  2. Intel C741® Chipset
  3. Up to 4TB 3DS ECC RDIMM, DDR5-5600MT/s (1DPC) or DDR5-4400MT/s (2DPC) in 16 DIMM slots
  4. 1 PCIe 5.0 x16
  5. 1 PCIe 5.0 x16 AIOM slot
  6. 5 PCIe 5.0 x8 via MCIO connectors
  7. AIOM for LAN
  8. I/O: 1 VGA, 1 COM, TPM header
  9. M.2 Interface: 2 PCIe 3.0x2&SATAM.2 Form Factor: 2280,22110M.2 Key: M-Key
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Optimized Servers


Specifications Resources Parts List
Specifications
Product SKUs
MBD-X13SEFR-A
Physical Stats
Form Factor
  • Proprietary FatTwin
Dimension
  • 8.44" x 18" (21.44cm x 45.72cm)
Processor
CPU
Core Count
  • Up to 64C
Note
  • Supports up to 350W TDP CPUs
System Memory
Memory
  • Slot Count: 16 DIMM Slots
  • Max Memory (1DPC): Up to 2TB 5600MT/s ECC DDR5 RDIMM/3DS RDIMM
  • Max Memory (2DPC): Up to 4TB 4400MT/s ECC DDR5 RDIMM/3DS RDIMM
DIMM Sizes
  • RDIMM:16GB, 24GB, 32GB, 48GB, 64GB, 96GB
  • 3DS RDIMM:128GB, 256GB
Memory Voltage
  • 1.1V
Error Detection
  • Corrects single-bit errors
  • Detects double-bit errors (using ECC memory)
On-Board Devices
Chipset
  • Intel® C741
SATA
  • SATA (6Gbps) via Intel® C741; RAID 0/1/5/10 support
IPMI
  • ASPEED AST2600 BMC
Network Controller
  • AIOM for LAN
Input / Output
LAN
  • 1 RJ45 1 GbE Dedicated IPMI LAN port(s)
USB
  • 2 USB 3.2 Gen1 port(s) (Rear)
Video
  • 1 VGA D-Sub Connector port(s)
Serial
  • 1 COM port(s) (header)
TPM
  • 1 TPM 2.0 Header
Expansion Slots
PCI-Express (PCIe) Configuration
  • 1 PCIe 5.0 x16 Right Riser slot
  • 1 PCIe 5.0 x16 AIOM slot
M2
  • 2 M.2 PCIe 3.0 x2 SATA slots (M-key 2280/22110)
System BIOS
BIOS Type
  • AMI UEFI
BIOS Features
  • ACPI 6.4
  • SMBIOS 3.5
  • UEFI 2.8 or above
Management
Software
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
PC Health Monitoring
Voltage
  • +12V
  • +3.3V
  • +5V
  • +5V standby
  • 4 -fan status
  • Chipset voltage
  • Monitors CPU voltages
  • Supports system management utility
  • System level control
  • VBAT
LED
  • CPU/system overheat LED
  • UID/remote UID LED
Temperature
  • CPU thermal trip support
  • Monitoring for CPU and chassis environment
  • PECI
  • Thermal monitor 2 (TM2) support
FAN
  • 4x 4-pin fan headers (up to 4 fans)
  • 4 fans with tachometer monitoring
  • Fan speed control
  • Overheat LED indication
Other Features
  • ACPI power management
  • Control of power-on for recovery from AC power loss
  • M.2 NGFF connector
  • Node manager support
  • UID
  • WOL
Operating Environment
Environmental Spec.
  • Operating Temperature: 0°C to 50°C (32°F to 122°F )
  • Non-operating Temperature: -30°C to 60°C (-22°F to 140°F)
  • Operating Relative Humidity: 8% to 80% (non-condensing)
  • Non-operating Relative Humidity: 8% to 90% (non-condensing)
Resources
Parts List
Optional Parts
Part Number Qty Description
TPM security module AOM-TPM-9670H 1 SPI capable TPM 2.0 with Infineon 9670 controller with horizontal form factor
AOM-TPM-9670V 1 SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor

X13SEFR-A

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