H13SST-G

H13 UP GrandTwin Server Board

Key Features


  1. AMD EPYC™ 9004/9005* Series Processors (*AMD EPYC™ 9005 series drop-in support requires board revision 2.x)
  2. System on Chip
  3. Support up to DDR5 12 DIMM slots (1DPC), speed up to 6000 MT/s (Please check System Memory Section for detail)
  4. AMD FCH controller for 8 SATA3 (6 Gbps) ports;
  5. 1x PCIe 4.0 x8 4C connector (for front I/O module), 5x PCIe 5.0 x8 MCIO connectors
  6. M.2 Interface: 2 SATA/PCIe 4.0 x4, M.2 Form Factor: 2280
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Optimized Servers


Specifications Resources Parts List
Specifications
Product SKUs
MBD-H13SST-G
Physical Stats
Form Factor
  • Proprietary GrandTwin
Dimension
  • 8.53" x 12.42" (21.67cm x 31.55cm)
Processor
CPU
Core Count
  • Up to 160C/320T
Note
  • Supports up to 400W TDP CPUs
System Memory
Memory
  • Slot Count: 12 DIMM Slots
  • Max Memory (1DPC): Up to 3TB 4800MT/s ECC DDR5 RDIMM (AMD EPYC™ 9004 Series Processor, MB R1.x/R2.0/R2.01)
  • Max Memory (1DPC): Up to 3TB 6000MT/s ECC DDR5 RDIMM (AMD EPYC™ 9005 Series Processor, MB R2.0)
  • Max Memory (1DPC): Up to 3TB 6300MT/s ECC DDR5 RDIMM (AMD EPYC™ 9005 Series Processor, MB R2.01)
Memory Voltage
  • 1.1V
Error Detection
  • Corrects single-bit errors
  • Detects double-bit errors (using ECC memory)
On-Board Devices
Chipset
  • System on Chip
IPMI
  • ASPEED AST2600 BMC
Input / Output
Video
  • 1 Aspeed AST2600 BMC port(s)
TPM
  • 1 TPM header
Others
  • 4 MCIO (PCIe 5.0 x8) port(s)
  • 1 MCIO (PCIe 5.0 x8/SATA3) port(s)
Expansion Slots
PCI-Express (PCIe) Configuration
  • 1 PCIe 4.0 x8 slot
M2
  • 2 M.2 PCIe 4.0 x4 SATA slots (M-key 2280)
System BIOS
BIOS Type
  • AMI 32MB SPI Flash EEPROM
BIOS Features
  • ACPI 6.4
  • Plug and Play (PnP)
  • SMBIOS 3.5 or later
  • UEFI 2.8
  • USB Keyboard support
Management
Software
Power Configurations
  • ACPI Power Management
  • Power-on mode control for AC power loss recovery
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
PC Health Monitoring
Voltage
  • +12V
  • +3.3V
  • +5V
  • +5V standby
  • 1.8V standby
  • 3.3V standby
  • CPU temperature
  • CPU thermal trip support
  • Memory temperature
  • VBAT
  • VRM temperature
LED
  • BMC/IPMI Heartbeat LED
  • UID/remote UID LED
FAN
  • 1x 4-pin fan header (up to 1 fan)
Other Features
  • RoT
Operating Environment
Environmental Spec.
  • Operating Temperature: 10°C to 35°C (50°F to 95°F )
  • Non-operating Temperature: -40°C to 70°C (-40°F to 158°F)
  • Operating Relative Humidity: 8% to 90% (non-condensing)
  • Non-operating Relative Humidity: 5% to 95% (non-condensing)
Resources
Parts List
Optional Parts
Part Number Qty Description
TPM security module (optional, not included) AOM-TPM-9670V 1 SPI capable TPM 2.0 with Infineon 9670 controller with horizontal form factor
AOM-TPM-9671V 1 SPI capable TPM 1.2 with Infineon 9670 controller with horizontal form factor

H13SST-G

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