2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 3 UPI up to 10.4 GT/s
Intel® C622
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz Or 2TB DCPMM, DDR4-2666MHz, in 16 DIMM slots; Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors
Dual Socket Socket P (LGA-3647) supported, CPU TDP supports Up to 205W TDP, 3 UPI up to 10.4 GT/s
Note
BIOS version 3.0a or above is required to support 2nd Generation Intel Xeon Scalable Processors-SP
BIOS version 3.0a or above is required to support 2nd Generation Intel Xeon Scalable Processors-SP BIOS version 3.2 or above is required to support 2nd Gen Intel® Xeon® Scalable processors (codenamed Cascade Lake-R)
System Memory
Memory Capacity
16 DIMM slots
Up to 2TB Intel® Optane™ Persistent Memory 100 Series, DDR4-2666MT/s
Up to 4TB 3DS ECC LRDIMM, DDR4-2933MT/s; Up to 4TB 3DS ECC RDIMM, DDR4-2933MT/s
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)
WOL, UID, RoHS, CPU thermal trip support for processor protection, Chassis intrusion header, Chassis intrusion detection, ATX power connector, ACPI power management, 8-pin 12v DC power connector, SDDC, NCSI header
SPI capable TPM 2.0 with Infineon 9670 controller with horizontal form factor SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor SPI capable TPM 1.2 with Infineon 9670 controller with vertical form factor SPI capable TPM 1.2 with Infineon 9670 controller with horizontal form factor
