SuperServer -2115HE-TNR

2U Hyper-E with single AMD EPYC™ 9004/9005 series processor, 6 hot-swap 2.5" drive bays and up to 4 PCIe 5.0 x16 slots

Integrated Board: H13SSH-E
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Key Applications

  • Virtualization
  • Scientific Virtualization
  • AI Inference and Machine Learning
  • Cloud Computing
  • Enterprise Server

Key Features

  1. Single AMD EPYC™ 9004/9005* Series Processor up to 400W with air cooling (*AMD EPYC™ 9005 series drop-in support requires board revision 2.x)
  2. Support for up to 3 double-width PCIe GPU accelerator cards
  3. Up to 24 DIMMs supporting up to 3TB DDR5-4800 in 1DPC or 6TB DDR5-4000 in 2DPC or 3TB DDR5-5200 in 1DPC or 6TB DDR5-4400 in 2DPC
  4. Flexible networking with up to 2 PCIe 5.0 x16 OCP 3.0 compatible AIOM slots
    Optional PCIe slot configurations up to 5 PCIe 5.0 x8 FHFL and 3 PCIe 4.0 x8 FHFL or 3 PCIe 5.0 x16 FHFL and 1 PCIe 4.0 x16 FHFL slots with support for double-width GPU/Accelerator cards
  5. 6 front hot-swap 2.5" NVMe drive bays
  6. Redundant 2000W Titanium Level Hot-plug power supplies
  7. 2U Rackmount chassis with 22.6" (574mm) depth
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AS-2115HE-TNR
Specifications Free Remote Testing Resources & Downloads
Specifications
Product SKUs
AS -2115HE-TNR
Motherboard
超級 H13SSH-E
Processor
CPU
Core Count
  • Up to 192C/384T
Note
  • Supports up to 400W TDP CPUs *
  • *Air Cooled CPUs with TDP over 400W only supported under specific conditions. Contact a Supermicro representative for details.
GPU
Max GPU Count
  • Up to 3 double-width or 4 single-width GPUs
CPU-GPU Interconnect
  • PCIe Gen5 x16
GPU-GPU Interconnect
  • PCIe
System Memory
Memory
  • Slot Count: 24 DIMM slots/12 Channels
  • Max Memory (1DPC): Up to 3TB 5200MT/s ECC DDR5 RDIMM (AMD EPYC™ 9005 Series Processor)
  • Max Memory (2DPC): Up to 6TB 4400MT/s ECC DDR5 RDIMM (AMD EPYC™ 9005 Series Processor)
  • Max Memory (1DPC): Up to 3TB 4800MT/s ECC DDR5 RDIMM (AMD EPYC™ 9004 Series Processor)
  • Max Memory (2DPC): Up to 6TB 4000MT/s ECC DDR5 RDIMM (AMD EPYC™ 9004 Series Processor)
Memory Voltage
  • 1.1V
On-Board Devices
Network Connectivity
Input / Output
LAN
  • 1 RJ45 1 GbE Dedicated BMC LAN port
USB
  • 2 USB 3.0 Type-A ports(Front)
Video
  • 1 VGA port
System BIOS
BIOS Type
  • AMI 32MB SPI Flash EEPROM
BIOS Features
  • ACPI 6.4
  • Plug and Play (PnP)
  • SMBIOS 3.5 or later
  • UEFI 2.8
  • USB Keyboard support
Management
Software
Power configurations
  • ACPI Power Management
  • Power-on mode control for AC power loss recovery
  • Power button override mechanism,
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
  • Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features
  • Cryptographically Signed Firmware
  • Secure Boot
  • Secure Firmware Updates
  • Automatic Firmware Recovery
  • Supply Chain Security: Remote Attestation
  • Runtime BMC Protections
  • System Lockdown
PC Health Monitoring
FAN
  • Fans with tachometer monitoring
  • Pulse Width Modulated (PWM) fan connectors
  • Status monitor for speed control
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors
Voltage
  • System temperature, Memory temperature, CPU temperature, 3.3V standby, +5V standby, +5V, +3.3V, +12V, CPU thermal trip support
Chassis
Form Factor
  • 2U Rackmount
Model
  • CSE-HE211-R000NFP-A
Dimensions and Weight
Height
  • 3.5" (88.9 mm)
Width
  • 17.2" (436.88 mm)
Depth
  • 22.6" (574 mm)
Package
  • 9.7" (H) x 23.5" (W) x 36.9" (D)
Weight
  • Gross Weight: 47.4 lbs (21.5 kg)
  • Net Weight: 34.4 lbs (15.6 kg)
Available Color
  • Silver
Front Panel
Buttons
  • Power On/Off
  • UID button
LED
  • HDD activity LED
  • LAN1 activity
  • LAN2 activity
  • Power Fail
  • Power status LED
  • System information
Expansion Slots
PCI-Express (PCIe) Configuration
  • Option A*
    • 2 PCIe 5.0 x16 (in x16) AIOM slots (OCP 3.0 compatible)
    • 3 PCIe 5.0 x16 (in x16) FHFL slots
    • 2 PCIe 4.0 x8 (in x16) FHFL slots
  • Option B*
    • 2 PCIe 5.0 x16 (in x16) AIOM slots (OCP 3.0 compatible)
    • 3 PCIe 5.0 x16 (in x16) FHFL slots
    • 1 PCIe 4.0 x16 (in x16) FHFL slot
  • Option C
    • 2 PCIe 5.0 x16 (in x16) AIOM slots (OCP 3.0 compatible)
    • 5 PCIe 5.0 x8 (in x16) FHFL slots
    • 3 PCIe 4.0 x8 (in x16) FHFL slots
  • (*Requires additional parts, please see the optional parts list for details. For more details on PCIe slot configuration options, please refer to the system callout images above.)
  • 檢視 AOC 選項
M.2
  • 1 M.2 PCIe 3.0 x4 slot (M-key 22110(default)/2280)
  • 1 M.2 PCIe 3.0 x2 slot (M-key 22110(default)/2280)
PCI
  • 8 PCI 5V 32-bit slots
Drive Bays / Storage
Drive Bays Configuration
  • Default: Total 6 bays
    • 6 rear hot-swap 2.5" PCIe 5.0 x4 NVMe drive bays
  • 檢視 NVMe 選項
M.2
  • 1 M.2 PCIe 3.0 x4 NVMe slot (M-key 22110(default)/2280)
  • 1 M.2 PCIe 3.0 x2 NVMe slot (M-key 22110(default)/2280)
  • 檢視 M.2 選項
System Cooling
Fans
  • Up to 6x 6cm heavy duty fans with optimal fan speed control
Air Shroud
  • 1 Air Shroud
Power Supply
2x 2000W
2x 2000W Redundant (1 + 1) Titanium Level (96%) Hot-plug power supplies
Dimension (WxHxL) 73.5 x 40 x 203 mm
Input 1000W: 100-127Vac
1000W: 100-127Vac / 50-60Hz
1800W: 200-220Vac
1800W: 200-220Vac / 50-60Hz
1980W: 220-230Vac
1980W: 220-230Vac / 50-60Hz
2000W: 230-240Vdc
2000W: 220-240Vac
2000W: 230-240Vac
2000W: 230-240Vac / 50-60Hz
2000W: 220-240Vac / 50-60Hz (for UL only)
2000W: 230-240Vdc / 50-60Hz (for China only)
+12V Max: 83A / Min: 0A (100Vac-127Vac)
Max: 150A / Min: 0A (200Vac-220Vac)
Max: 165A / Min: 0A (220Vac-230Vac)
Max: 166A / Min: 0A (230Vac-240Vac)
12V SB Max: 3.5A / Min: 0A
Max: 3.5A
Output Type Backplanes (gold finger)
Operating Environment
ROHS
  • RoHS Compliant
Environmental Spec.
  • Operating Temperature: 10°C to 30°C (50°F to 86°F)
  • Non-operating Temperature: -40°C to 70°C (-40°F to 158°F)
  • Operating Relative Humidity: 8% to 90% (non-condensing)
  • Non-operating Relative Humidity: 5% to 95% (non-condensing)
Environmental / Recycling
Recycle
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