Key Applications - Multi-Access Edge Computing - Flex-RAN, Open-RAN vBBU - Telecom DRAN, CRAN, and Edge Core Application - Enterprise Edge Computing Key FeaturesThree hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
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Parts List - (Items Included) | |||
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Part Number![]() |
Qty![]() |
Description![]() |
Motherboard / Chassis |
MBD-X12SPED-F CSE-SE201-R2K07P |
3 1 |
Super X12SPED-F Motherboard 2U Chassis |
Add-on Card / Module | AOM-BPN-SE3N-P | 1 | Backplane for SuperEdge 2U3N,RoHS |
Cable 1 | CBL-0218L | 1 | 11.5CM KVM/SUVI 36PIN TO 9PIN/15PIN/2USB |
Riser Card | RSC-W-66G4 | 3 | 1U LHS WIO Riser card with two PCI-E 4.0 x16 slots,HF,RoHS |
Riser Card | RSC-WR-6 | 3 | 1U RHS WIO Riser card with one PCI-E 4.0 x16 slot,HF,RoHS |
Software | SFT-OOB-LIC | 3 | License key for enabling OOB BIOS management |
Heatsink / Retention | SNK-P1044V | 3 | 1U Passive CPU Heat Sink for B12 ICX/CPX CPU |
*Power Supply | PWS-2K07F-1R | 2 | 1U 2000W 90-264Vac/47-63Hz, wide DC input 180Vdc-300Vdc, 12V |
*Power Distributor | PDB-PT201-DSG | 2 | Super Edge pass through board support Ultra powers up to 6KW |
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Optional Parts List | |||
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Part Number | Qty | Description | |
TPM security module | AOM-TPM-9670V | - | SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor |