SuperServer

X14 DP 2U short-depth rear I/O system with 6 hot-swap 2.5" NVMe/SAS/SATA bays and 4 PCIe 5.0 x16 slots + 2 PCIe 5.0 x16 AIOM slots

Integrated Board: X14DBM-SP
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Key Applications

  • Virtualization
  • Software-defined Storage
  • AI Inference and Machine Learning
  • Cloud Computing
  • Enterprise Server
  • 5G Networking

Key Features

  1. Intel® Xeon® 6700/6500 series processors with P-cores or 6700 series processors with E-cores
  2. 32 DIMM slots supporting up to 8TB of memory
  3. Optional PCIe slot configurations up to 8 PCIe 5.0 x8 (6FHFL + 2 FHHL) or 4 PCIe 5.0 x16 (3 FHFL + 1 FHHL) slots with support for double-width GPU/Accelerator cards
  4. Flexible networking options with up to 2 AIOM networking slots (OCP NIC 3.0 compatible)
  5. 6 Front hot-swap 2.5" NVMe/SAS/SATA drive bays with optional configurations for additional 2 or 4 Rear hot-swap 2.5" NVMe drive bays (space share with PCIe slots); 2x internal M.2 NVMe drive slots; Optional RAID support via storage add-on card
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SYS-222HE-TN
Specifications Free Remote Testing Resources & Downloads Parts List
Specifications
Product SKUs
SYS-222HE-TN
Motherboard
超級 X14DBM-SP
Processor
CPU
Core Count
  • P-cores: Up to 86C/172T; Up to 336MB Cache per CPU
  • E-cores: Up to 144C/144T; Up to 108MB Cache per CPU
Note
  • Supports up to 350W TDP CPUs (Air Cooled)
  • Supports up to 350W TDP CPUs (Liquid Cooled)​
GPU
Max GPU Count
  • Up to 3 double-width or 4 single-width GPUs
CPU-GPU Interconnect
  • PCIe 5.0 x16 CPU-to-GPU Interconnect
GPU-GPU Interconnect
  • PCIe
System Memory
Memory
  • Slot Count: 32 DIMM slots
  • Max Memory (1DPC): Up to 4TB 6400MT/s ECC DDR5 RDIMM
  • Max Memory (1DPC): Up to 4TB 8800MT/s ECC DDR5 MRDIMM (P-core only)
  • Max Memory (2DPC): Up to 8TB 6000MT/s ECC DDR5 RDIMM
  • 檢視記憶體選項
Memory Voltage
  • 1.1V
On-Board Devices
NVMe
Network Connectivity
Input / Output
LAN
  • 1 RJ45 1 GbE Dedicated BMC LAN port
USB
  • 2 USB 3.0 ports(rear)
Video
  • 1 VGA port
System BIOS
BIOS Type
  • AMI 64MB SPI Flash
Management
Software
Power configurations
  • Power-on mode for AC power recovery
  • ACPI Power Management
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
  • Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features
  • Cryptographically Signed Firmware
  • Secure Boot
  • Secure Firmware Updates
  • Automatic Firmware Recovery
  • Supply Chain Security: Remote Attestation
  • Runtime BMC Protections
  • System Lockdown
PC Health Monitoring
CPU
  • Monitors for CPU Cores, Chipset Voltages, Memory
FAN
  • Fans with tachometer monitoring
  • Pulse Width Modulated (PWM) fan connectors
  • Status monitor for speed control
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors
Chassis
Form Factor
  • 2U Rackmount
Model
  • CSE-HE211-R000NFP
Dimensions and Weight
Height
  • 3.5" (88.9 mm)
Width
  • 17.2" (436.88 mm)
Depth
  • 22.6" (574 mm)
Package
  • 9.7" (H) x 23.5" (W) x 36.9" (D)
Weight
  • Gross Weight: 47.4 lbs (21.5 kg)
  • Net Weight: 34.4 lbs (15.6 kg)
Available Color
  • Silver
Front Panel
Buttons
  • Power On/Off
  • Power On/Off 
  • UID button
LED
  • HDD activity LED
  • LAN1 activity
  • LAN2 activity
  • Power Fail
  • Power status LED
  • System information
Expansion Slots
PCI-Express (PCIe) Configuration
  • Option A*
    • 3 PCIe 5.0 x16 (in x16) FH/10.5"L double-width slots
    • 1 PCIe 5.0 x16 (in x16) FHHL slot
    • 2 PCIe 5.0 x16 AIOM slots (OCP 3.0 compatible)
  • Option B*
    • 6 PCIe 5.0 x8 (in x16) FH/10.5"L slots
    • 2 PCIe 5.0 x8 (in x16) FHHL slots
    • 2 PCIe 5.0 x16 AIOM slots (OCP 3.0 compatible)
  • (*Requires additional parts, please see the optional parts list for details. For more details on PCIe slot configuration options, please refer to the system callout images above.)
  • 檢視 AOC 選項
CXL Support
  • Up to 4 CXL 2.0 x16/x8 devices
M.2
  • 2 M.2 PCIe 5.0 x2 NVMe slots (M-key 2280/22110)
Drive Bays / Storage
Drive Bays Configuration
  • Default: Total 6 bays
    • 6 front hot-swap 2.5" NVMe*/SAS*/SATA* drive bays
  • Option A: Total 8 bays
    • 6 front hot-swap 2.5" NVMe*/SAS*/SATA* drive bays
    • 2 rear hot-swap 2.5" NVMe* drive bays
  • Option B: Total 10 bays
    • 6 front hot-swap 2.5" NVMe*/SAS*/SATA* drive bays
    • 4 rear hot-swap 2.5" NVMe* drive bays
  • (*NVMe/SAS/SATA support may require additional storage controller and/or cables, please see the optional parts list for details)
  • 檢視 NVMe 選項
M.2
System Cooling
Fans
  • Up to 6 counter-rotating 60x60x56mm Fan(s)
Air Shroud
  • 4 Air Shrouds
Liquid Cooling
  • Direct to Chip (D2C) Cold Plate (optional)
Power Supply
2x 2000W
2x 2000W Redundant (1 + 1) Titanium Level (96%) power supplies
Dimension (WxHxL) 73.5 x 40 x 203 mm
Input 1000W: 100-127Vac
1000W: 100-127Vac / 50-60Hz
1800W: 200-220Vac
1800W: 200-220Vac / 50-60Hz
1980W: 220-230Vac
1980W: 220-230Vac / 50-60Hz
2000W: 230-240Vdc
2000W: 220-240Vac
2000W: 230-240Vac
2000W: 230-240Vac / 50-60Hz
2000W: 220-240Vac / 50-60Hz (for UL only)
2000W: 230-240Vdc / 50-60Hz (for China only)
+12V Max: 83A / Min: 0A (100Vac-127Vac)
Max: 150A / Min: 0A (200Vac-220Vac)
Max: 165A / Min: 0A (220Vac-230Vac)
Max: 166A / Min: 0A (230Vac-240Vac)
12V SB Max: 3.5A / Min: 0A
Max: 3.5A
Output Type Backplanes (gold finger)
2x 1300W
2x 1300W Redundant (1 + 1) power supplies
Dimension (WxHxL) 73.5 x 40 x 203 mm
Input 1300W: -44--65Vdc / 50-60Hz
DC Input 108.3A Max
+12V Max: 108.3A / Min: 0A
12V SB Max: 2.1A / Min: 0A
Output Type Backplanes (gold finger)
2x 1200W
2x 1200W Redundant (1 + 1) Titanium Level (96%) power supplies
Dimension (WxHxL) 73.5 x 40 x 203 mm
Input 800W: 100-127Vac
800W: 100-127Vac / 50-60Hz
1200W: 200-240Vdc (For CCC Only)
1200W: 200-240Vac
1200W: 200-240Vac / 50-60Hz
1200W: 200-240Vdc / 50-60Hz (for CCC only)
+12V Max: 66.7A / Min: 0A (100Vac-127Vac)
Max: 100A / Min: 0A (200Vac-240Vac)
Max: 100A / Min: 0A (200Vdc-240Vdc)
Max: 100A / Min: 0A (200Vdc-240Vdc) (For CCC Only)
12V SB Max: 2.1A / Min: 0A
Output Type Backplanes (gold finger)
Operating Environment
Environmental Spec.
  • Operating Temperature: 10°C to 35°C (50°F to 95°F)
  • Non-operating Temperature: -40°C to 70°C (-40°F to 158°F)
  • Operating Relative Humidity: 8% to 90% (non-condensing)
  • Non-operating Relative Humidity: 5% to 95% (non-condensing)
Free Remote Testing

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日程表 存取
Resources & Downloads
Parts List
Optional Parts List
Part Number Qty Description
Cable Management Arm + Rail Set MCP-290-00168-0N • + MCP-290-11901-0N • - 7.5" cable management arm + 41" long ball-bearing rail set
Drive Bay Configuration Options Refer to User's Manual - 8 & 16 drive bay configuration options for NVMe, SAS, or SATA support
Global Services & Support OS4HR3/2/1 - Gold Level, 3/2/1-year onsite 24x7x4 SLA
OSNBD3/2/1 - Silver Level, 3/2/1-year onsite NBD SLA
SMSAD3/2/1 - Bronze Level, 3/2/1-year 3BD SLA
PCIe Slot Configuration Options Refer to User's Manual - PCIe slot configuration options to enable PCIe slots 1-8
Rail Set MCP-290-11901-0N • 1 41" ball-bearing rail set for Hyper servers
MCP-290-11902-0N • 1 35.3" ball-bearing rail set for Hyper servers
MCP-290-11903-0N • 1 30.5" ball-bearing rail set
MCP-290-21103-0N (included in the system ) 1 21.4" ball-bearing rail set for Hyper servers
Software SFT-DCMS-Single 1 DataCenter Management Package (per node license)
Trusted Platform Module Options AOM-TPM-9672V-FIPS-O 1 AOM-TPM-9672V-FIPS TPM 2.0 support FIPS
AOM-TPM-9672V-O • 1 SPI capable vertical TPM 2.0

SuperServer SYS-222HE-TN

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