2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 3 UPI up to 10.4 GT/s
Intel® C624
Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots; Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)
2 PCIe 3.0 x16 Left Riser Slot M.2 Interface: 1 PCIe 3.0 x4 M.2 Form Factor: 2242/2260/2280 M.2 Key: M-Key
Dual LAN with 10GBase-T with Intel® X557
1 VGA D-Sub Connector port
Intel® PCH SATA controller for
...
...
SpecificationsResources
Specifications
Product SKUs
MBD-X11DSN-TS
Physical Stats
Form Factor
Proprietary
Dimension
11.5" x 13.9" (29.21cm x 35.31cm)
Processor
CPU
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors
Dual Socket Socket P (LGA-3647) supported, CPU TDP supports Up to 205W TDP, 3 UPI up to 10.4 GT/s
Core
Up to 28 cores
Note
BIOS version 3.2 or above is required to support 2nd Gen Intel® Xeon® Scalable processors (codenamed Cascade Lake-R)
System Memory
Memory Capacity
12 DIMM slots
Up to 3TB 3DS ECC LRDIMM, DDR4-2933MT/s; Up to 3TB 3DS ECC RDIMM, DDR4-2933MT/s
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)
WOL, UID, RoHS, Node manager support, CPU thermal trip support for processor protection, Control of power-on for recovery from AC power loss, Chassis intrusion detection, RoHS, Halogen Free, Innovation Engine
