X14SBT-G

X14 UP GrandTwin Server Board

Key Features


  1. Intel® Xeon® 6700/6500 series processors with P-cores or 6700 series processors with E-cores, Single Socket LGA-4710 (Socket E2) supported, CPU TDP supports Up to 350W TDP
  2. 16 DIMM slots support RDIMM / MRDIMM(1DPC)
  3. 1 PCIe 5.0 x8 via customized 124-pin slim cool edge connector(for front I/O module)
  4. 2 PCIe 5.0 x16 via Molex Impleplus connectors
  5. 4 PCIe 5.0 X8 via MCIO connectors
  6. M.2 Interface: 2 PCIe5.0 x4 (Form Factor: 2280, 22110, M-Key)
  7. I/O: 1 COM, TPM header
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Optimized Servers


Specifications Resources Parts List
Specifications
Product SKUs
MBD-X14SBT-G
Physical Stats
Form Factor
  • Proprietary
Dimension
  • 8.53" x 12.42" (21.67cm x 31.55cm)
Processor
CPU
Core Count
  • P-cores: Up to 86C
  • E-cores: Up to 144C
Note
  • Supports up to 350W TDP CPUs
System Memory
Memory
  • Slot Count: 16 DIMM Slots
  • Max Memory (1DPC): Up to 512GB 8000MT/s ECC DDR5 MRDIMM (P-core only)
  • Max Memory (1DPC): Up to 2TB 6400MT/s ECC DDR5 RDIMM/3DS RDIMM
  • Max Memory (2DPC): Up to 4TB 5200MT/s ECC DDR5 RDIMM/3DS RDIMM
DIMM Sizes
  • MRDIMM (P-core only):32GB, 64GB
  • RDIMM:16GB, 24GB, 32GB, 48GB, 64GB, 96GB, 128GB
  • 3DS RDIMM:256GB
Memory Voltage
  • 1.1V
Error Detection
  • Corrects single-bit errors
  • Detects double-bit errors (using ECC memory)
On-Board Devices
Chipset
  • System on Chip
IPMI
  • ASPEED AST2600 BMC
Input / Output
Serial
  • 1 COM port(s) (header)
TPM
  • 1 TPM header
Expansion Slots
PCI-Express (PCIe) Configuration
  • 4 PCIe 5.0 x8 via MCIO Connector slots
  • 2 PCIe 5.0 x16 via Molex Impleplus Connector slots
  • 1 PCIe 5.0 x8 slot
M2
  • 2 M.2 PCIe 5.0 x4 slots (M-key 2280/22110)
System BIOS
BIOS Type
  • AMI 64MB UEFI
BIOS Features
  • ACPI 6.5
  • SMBIOS 3.7 or later
  • UEFI 2.9
Management
Software
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
PC Health Monitoring
Voltage
  • +12V
  • +3.3V
  • +5V
  • +5V standby
  • Monitors CPU voltages
  • Supports system management utility
  • System level control
  • VBAT
LED
  • CPU/system overheat LED
  • UID/remote UID LED
Temperature
  • CPU thermal trip support
  • Monitoring for CPU and chassis environment
  • PECI
  • Thermal monitor 2 (TM2) support
FAN
  • Fan speed control
Other Features
  • ACPI power management
  • Control of power-on for recovery from AC power loss
  • M.2 NGFF connector
  • UID
  • WOL
Operating Environment
Environmental Spec.
  • Operating Temperature: 0°C to 50°C (32°F to 122°F )
  • Non-operating Temperature: -30°C to 60°C (-22°F to 140°F)
  • Operating Relative Humidity: 8% to 80% (non-condensing)
  • Non-operating Relative Humidity: 8% to 90% (non-condensing)
Resources
Parts List
Optional Parts
Part Number Qty Description
CPU carrier SKT-1543H-0000-FXC 1 E2A CPU carrier for Intel® Xeon® 6 processors(XCC)
SKT-1544H-0000-FXC 1 E2B CPU carrier for Intel® Xeon® 6 processors(HCC/LCC/HDCC)
TPM security module (optional, not included) AOM-TPM-9672V 1 SPI capable TPM 2.0 with Infineon 9672 controller in vertical form factor

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