B14SBE-CPU-AP

X14 UP SuperBlade Server Board

Key Features


  1. Intel® Xeon® 6900-series processors with P-cores, Single Socket LGA-7529 (Socket BR) supported, CPU TDP supports Up to 500W TDP
  2. Up to 1.5TB DDR5 ECC RDIMM or 3TB RDIMM (3DS) with speeds of up to 6400MT/s (1DPC) or up to 3TB MRDIMM (1DPC) DDR5-8800MT/s in 12 DIMM slots
  3. 6x PCIe 5.0 x8 MCIO connectors for GPU Riser/NVMe/AIOM add on module
  4. Power distribution board to support extra GPU in 6/8U blade1x Blade Power Connector1x 12pin+4S 12VHPWR Connector2x Side Band Connectors for Motherboard Control
  5. EDSFF Interface: EDSFF 1C swich to M.2, Up to 2x PCIe 5.0 x2 via adaptor card, RAID 0 & 1M.2 Form Factor: 2280M.2 Key: M-Key
  6. Onboard Intel® Columbiaville Ethernet Controller E810-XXVAM2
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Optimized Servers


Specifications Resources Parts List
Specifications
Product SKUs
MBD-B14SBE-CPU-AP
Physical Stats
Form Factor
  • Proprietary
Dimension
  • 12.1" x 9.36" (30.74cm x 23.77cm)
Processor
CPU
Core Count
  • Up to 128C
Note
  • Supports up to 500W TDP CPUs
System Memory
Memory
  • Slot Count: 12 DIMM Slots
  • Max Memory (1DPC): Up to 3TB 8800MT/s ECC DDR5 MRDIMM
  • Max Memory (1DPC): Up to 1.5TB 6400MT/s ECC DDR5 RDIMM
  • Max Memory (1DPC): Up to 3TB 6400MT/s ECC DDR5 3DS RDIMM
DIMM Sizes
  • 3DS RDIMM:256GB
  • MRDIMM:32GB, 48GB, 64GB, 96GB, 128GB, 256GB
  • RDIMM:32GB, 48GB, 64GB, 96GB, 128GB
Memory Voltage
  • 1.1V
Error Detection
  • Corrects single-bit errors
  • Detects double-bit errors (using ECC memory)
On-Board Devices
Chipset
  • System on Chip
IPMI
  • ASPEED AST2600 BMC
Network Controller
  • Dual LAN with Intel® Ethernet Controller E810-XXVAM2, Two (2) 25GbE Ethernet ports from KR interface to BP
Input / Output
TPM
  • 1 TPM 2.0 Header
Expansion Slots
PCI-Express (PCIe) Configuration
  • 1 PCIe 4.0 x16 via Mezzanine Card Connector slot
  • 1 PCIe 4.0 x16 SIOM slot
  • 6 PCIe 5.0 x8 via MCIO Connector slots , For GPU Riser/NVMe/AIOM add on module
M2
  • 2 M.2 PCIe 5.0 x2 slots (M-key 2280; M.2 support requires an optional M.2 adapter card)
System BIOS
BIOS Type
  • AMI 64MB UEFI
BIOS Features
  • ACPI 6.5
  • SMBIOS 3.7 or later
  • UEFI 2.9
Management
Software
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
PC Health Monitoring
Voltage
  • +12V
  • +3.3V
  • +5V
  • +5V standby
  • GPUtemperature
  • Monitors CPU voltages
  • Supports system management utility
  • System level control
  • VBAT
LED
  • CPU/system overheat LED
  • UID/remote UID LED
Temperature
  • CPU thermal trip support
  • Monitoring for CPU and chassis environment
  • PECI
  • Thermal monitor 2 (TM2) support
FAN
  • Fan speed control
Other Features
  • ACPI power management
  • Control of power-on for recovery from AC power loss
  • UID
Operating Environment
Environmental Spec.
  • Operating Temperature: 10°C to 35°C (50°F to 95°F )
  • Non-operating Temperature: -30°C to 60°C (-22°F to 140°F)
  • Operating Relative Humidity: 8% to 80% (non-condensing)
  • Non-operating Relative Humidity: 8% to 90% (non-condensing)
Resources
Parts List
Optional Parts
Part Number Qty Description
CPU carrier SKT-1554H-BK00-FXC 1 CPU carrier for  Intel® Xeon® 6 processors (UCC)
QRG QRG-2709 1 Motherboard Quick Reference Guide

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