SuperServer

2U UP X14 MegaDC with Modular Front I/O

Key Applications

  • Edge Computing
  • CDN, Edge Nodes
  • 5G Core and Edge
  • Cloud Computing
  • Telco & Cloud Service Providers
  • Multi-Access Edge Computing (MEC)
  • Telco Edge

Key Features

  1. Single Socket E2 (LGA-4710) Intel® Xeon® 6700/6500 series processors with P-cores or 6700 series processors with E-cores up to 350W with air cooling
  2. Support for up to 2 double-width GPU accelerator cards
  3. Up to 16 DIMMs supporting up to 4TB DDR5-6000 in 2DPC
  4. Flexible networking with up to 1 OCP 3.0 compatible AIOM slots
  5. Up to 2 PCIe 5.0 x16 Double-Wide (DW) FHFL + 1 PCIe 5.0 x8 FHHL + 1 PCIE 5.0 x8 LP + 1 PCIe 5.0 x16 TSFF AIOM slots
  6. Optional Modular Storage & Expansion: (8x E3.S/L), (8x E1.S), (2x FHHL + 4x E1.S)
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SYS-212MT-FNR
Specifications Free Remote Testing Resources & Downloads Parts List
Specifications
Product SKUs
SuperServer SYS-212MT-FNR
Motherboard
超級 X14SBPM
Processor
CPU
Core Count
  • P-cores: Up to 86C/172T; Up to 336MB Cache
  • E-cores: Up to 144C/144T; Up to 108MB Cache
Note
  • Supports up to 350W TDP CPUs (Air Cooled)
GPU
Max GPU Count
  • Up to 2 double-width GPUs
Supported GPU
  • NVIDIA PCIe: H200 NVL (141GB), L40S, NVIDIA RTX PRO™ 4500 Blackwell, NVIDIA RTX PRO™ 6000 Blackwell Server Edition
  • 檢視 GPU 選項
CPU-GPU Interconnect
  • PCIe Gen5 x16
GPU-GPU Interconnect
  • NVIDIA® NVLink™
System Memory
Memory
  • Slot Count: 16 DIMM slots
  • Max Memory (2DPC): Up to 4TB 6000MT/s ECC DDR5 RDIMM
Memory Voltage
  • 1.1V
On-Board Devices
NVMe
  • NVMe; RAID 0/1/5/10 support(Intel® VROC RAID key required)
Chipset
  • System on Chip
Network Connectivity
Input / Output
LAN
  • 1 RJ45 1 GbE Dedicated BMC LAN port
  • 1 RJ45 10 GbE LAN port (Intel® E610)
USB
  • 2 USB 3.0 ports(front)
Video
  • 1 Mini-DP port(Front)
Serial
  • 1 COM (Micro USB) port(Front)
TPM
  • 1 TPM Onboard TPM & TPM Header
System BIOS
BIOS Type
  • AMI 64MB Flash ROM
Management
Software
Power configurations
  • Power-on mode for AC power recovery
  • ACPI Power Management
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
  • Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features
  • Cryptographically Signed Firmware
  • Secure Boot
  • Secure Firmware Updates
  • Automatic Firmware Recovery
  • Supply Chain Security: Remote Attestation
  • Runtime BMC Protections
  • System Lockdown
PC Health Monitoring
CPU
  • Monitors for CPU Cores, Chipset Voltages, Memory
FAN
  • Fans with tachometer monitoring
  • Pulse Width Modulated (PWM) fan connectors
  • Status monitor for speed control
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors
Chassis
Form Factor
  • 2U Rackmount
Model
  • CSE-LB23MTS-R000NDP
Dimensions and Weight
Height
  • 3.5" (88.9 mm)
Width
  • 17.2" (436.88 mm)
Depth
  • 17" (431.8 mm)
Package
  • 11" (H) x 26.5" (W) x 34" (D)
Weight
  • Gross Weight: 59 lbs (26.76 kg)
  • Net Weight: 35.3 lbs (16 kg)
Available Color
  • Black
Front Panel
Buttons
  • Power On/Off 
  • UID button
LED
  • HDD activity
  • Network activity
  • Power status
  • System information (overheat/UID) 
Expansion Slots
PCI-Express (PCIe) Configuration
  • Default
    • 2 PCIe 5.0 x16 FHFL double-width slots
    • 1 PCIe 5.0 x8 FHHL slot
    • 1 PCIe 5.0 x8 LP slot
    • 1 PCIe 5.0 x16 AIOM slot (OCP 3.0 compatible)
  • 檢視 AOC 選項
CXL Support
  • Up to 2 CXL 2.0 x16/x8 devices
M.2
  • 1 M.2 PCIe 5.0 x2 NVMe slot (M-key 22110(default)/2280)
Drive Bays / Storage
Drive Bays Configuration
  • Default: Total 8 bays
    • 8 front hot-swap E1.S PCIe 5.0 x4 NVMe drive bays
  • Option A: Total 8 bays
    • 8 front hot-swap E3.S 1T PCIe 5.0 x4 NVMe drive bays
  • Option B: Total 8 bays
    • 8 front hot-swap E3.L 1T PCIe 5.0 x4 NVMe drive bays
M.2
  • 1 M.2 PCIe 5.0 x2 NVMe slot (M-key 22110(default)/2280)
System Cooling
Fans
  • 5 Hot-Swappable, High Performance PWM 80x80x38mm Fan(s)
Air Shroud
  • 1 Air Shroud
Power Supply
Operating Environment
ROHS
  • RoHS Compliant
Environmental Spec.
  • Name: A2
  • Operating Temperature: 10°C to 35°C (50°F to 95°F)
  • Non-operating Temperature: -30°C to 60°C (-40°F to 140°F)
  • Operating Relative Humidity: 8% to 80% (max 21° DP; non-condensing)
  • Non-operating Relative Humidity: 8% to 90% (max 38° DP; non-condensing)
Environmental / Recycling
Recycle
Free Remote Testing

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排程存取
Resources & Downloads
Parts List
Optional Parts List
Part Number Qty Description
Trusted Platform Module Options AOM-TPM-9672V-FIPS-O 1 AOM-TPM-9672V-FIPS TPM 2.0 support FIPS
AOM-TPM-9672V-O 1 SPI capable vertical TPM 2.0

MegaDC SuperServer SYS-212MT-FNR Coming Soon

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