Supermicro's End-to-End Liquid-Cooled Solutions Propel Industry's Transition to Sustainable AI Data Centers with the NVIDIA Blackwell Platform

全新 JBOF 架构助力存储独立软件供应商和云服务提供商，为人工智能时代构建高性能、高效且智能的数据平台

全新Supermicro系统可帮助客户实现数据中心升级，进而更顺畅地运行AI工作负载

New 3U Server Supports up to 18 GPUs and Features Dual Intel® Xeon® 6900 series processors with P-cores

Designed for Data Center Scale Reduction in TCO and Enabling Large AI Clusters to Perform with a Lower Energy Budget, Liquid Cooling Solution Handles the Highest Wattage Servers Containing the Latest NVIDIA GPUs and CPUs, Resulting in Lower Costs for AI Factories – Over 2,000 Liquid Cooled Racks Delivered Since June 2024

各公司将工程和设计专业知识相结合，开发下一代系统，支持本地和云数据中心的 Gen AI 和 HPC 工作负载，加速构建绿色 IT

完整的架构升级包含全新性能优化 CPU、新一代GPU的支持、升级版内存MRDIMM、400GbE 网络、包含 E1.S 和 E3.S 硬盘的新型存储选项，以及直达芯片（Direct-to-Chip，D2C）液冷技术，并基于即将推出、搭载性能核（P-Core）的 Intel® Xeon® 6900 系列处理器（原代号为Granite Rapids-AP），支持高需求工作负载

The New Rack-Scale Ready FlexTwin™ Systems Deliver Unprecedented Compute-Density in a Multi-Node Form Factor, with DLC dual CPUs up to 500W Each per Node, Front Node Access and Optimized Networking

A Complete Architecture Upgrade that Includes New Performance-Optimized CPUs, Next-Generation GPU support, Upgraded Memory MRDIMMs, 400GbE Networking, New Storage Options Including E1.S and E3.S drives, and Direct-to-Chip Liquid Cooling, based on the Upcoming Intel® Xeon® 6900 Series Processors with P-Cores (formerly codenamed Granite Rapids-AP) Supporting Demanding Workloads

5th Annual Summit Features 7 Sessions with 17 Leading Storage Technology Partners and 30 speakers to Discuss Best Practices and New Developments in Storage for AI, CSP, HPC, HCI and many other Workloads