SuperServer ARS-111GL-DSHR-LCC

1U 2-Node NVIDIA GH200 Grace Hopper Superchip system with liquid-cooling supporting NVIDIA BlueField-3 or NVIDIA ConnectX-7

ARS-111GL-DSHR-LCC Main ARS-111GL-DSHR-LCC Angle ARS-111GL-DSHR-LCC Top ARS-111GL-DSHR-LCC Front ARS-111GL-DSHR-LCC Rear
Integrated Board: G1SMH-G
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Key Applications

  • High Performance Computing
  • AI/Deep Learning Training and Inference
  • Large Language Model (LLM) and Generative AI

Key Features

Two nodes in a 1U form factor. Each node supports the following:

  1. Two nodes in a 1U Form Factor. This system currently supports up to eight E1.S drives with NVIDIA's BlueField®-3 in Storage Configuration Mode. Please consult with your Supermicro Salesperson for details
  2. High density 1U 2-node GPU system with Integrated NVIDIA® H100 GPU
  3. NVIDIA Grace Hopper™ Superchip (Grace CPU and H100 GPU), up to 72 cores per node (Liquid-Cooled)
  4. NVLink® Chip-2-Chip (C2C) high-bandwidth, low-latency interconnect between CPU and GPU at 900GB/s
  5. Up to 576GB of coherent memory per node including 480GB LPDDR5X (CPU) and 96GB of HBM3 (GPU) for LLM applications
  6. 2 PCIe 5.0 x16 slots per node (1 PCIe FHFL slot dedicated to BlueField-3 and 1 PCIe LP)
  7. Supports up to eight hot-swap E1.S drives bays (four per node).
  8. 7 Hot-Swap Heavy Duty Fans with Optimal Fan Speed Control
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ARS-111GL-DSHR-LCC
Specifications Free Remote Testing Resources & Downloads
Specifications
Product SKUs
ARS-111GL-DSHR-LCC
Motherboard
Super G1SMH-G
Processor (per Node)
CPU
  • NVIDIA 72-core NVIDIA Grace CPU on GH200 Grace Hopper™ Superchip
Note
  • Supports up to 2000W TDP CPUs (Liquid Cooled)​
GPU (per Node)
Max GPU Count
  • Up to 1 onboard GPU
Supported GPU
  • NVIDIA: H100 Tensor Core GPU on GH200 Grace Hopper™ Superchip (Liquid-cooled)
  • View GPU Options
GPU-GPU Interconnect
  • PCIe
System Memory (per Node)
Memory
  • Slot Count: Onboard Memory
  • Max Memory: Up to 480GB ECC LPDDR5X
  • Additional GPU Memory: Up to 96GB ECC HBM3
On-Board Devices (per Node)
Chipset
  • System on Chip
Network Connectivity
Input / Output (per Node)
LAN
  • 1 RJ45 1 GbE Dedicated BMC LAN port
USB
  • 1 port(Rear)
Video
  • 1 mini-DP port
System BIOS
BIOS Type
  • AMI 64MB SPI Flash EEPROM
Management
Power configurations
  • Power-on mode for AC power recovery
  • ACPI Power Management
PC Health Monitoring
CPU
  • Monitors for CPU Cores, Chipset Voltages, Memory
FAN
  • Fans with tachometer monitoring
  • Status monitor for speed control
  • Pulse Width Modulated (PWM) fan connectors
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors
Chassis
Form Factor
  • 1U Rackmount
Model
  • CSE-MG102TS-R000NDFP-2N
Dimensions and Weight
Height
  • 1.7" (43.6 mm)
Width
  • 17.26" (438.4 mm)
Depth
  • 35.4" (900 mm)
Package
  • 9.05" (H) x 27.36" (W) x 46.06" (D)
Weight
  • Gross Weight: 49.21 lbs (22.32 kg)
  • Net Weight: 33.64 lbs (15.26 kg)
Available Color
  • Silver
Front Panel
Buttons
  • Power On/Off button
Expansion Slots (per Node)
PCI-Express (PCIe) Configuration
Drive Bays / Storage (per Node)
Drive Bays Configuration
M.2
System Cooling
Fans
  • 7 Removable heavy-duty 4cm Fan(s)
Liquid Cooling
  • Direct to Chip (D2C) Cold Plate (optional)
Power Supply
2x 2700W
2x 2700W Redundant Titanium Level (96%) power supplies
Dimension (WxHxL)73.5 x 40 x 185 mm
Input2700W: 200-240Vac / 50-60Hz
2700W: 240-240Vdc / 50-60Hz (for CQC only)
+12VMax: 225A / Min: 0A (200Vac-240Vac)
Max: 225A / Min: 0A (240Vdc-240Vdc)
12V SBMax: 4A / Min: 0A
Output TypeBackplanes (gold finger)
Operating Environment
Environmental Spec.
  • Operating Temperature: 10°C to 35°C (50°F to 95°F)
  • Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
  • Operating Relative Humidity: 8% to 90% (non-condensing)
  • Non-operating Relative Humidity: 5% to 95% (non-condensing)
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Resources & Downloads

GPU ARS-111GL-DSHR-LCC

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