Buyer’s Guide
Everything you need to know about Supermicro’s multi-node systems is here. Save space and improve efficiency without compromising performance.
Unmatched Density and Efficiency
Increased Density and Improved Energy Efficiency
- Maximize efficiency with advanced liquid cooling, capturing up to 90% of heat generated.
- Achieve high energy efficiency and compute density with designs that reduce fan power by up to 86%.
- Enhanced efficiency with shared power and cooling architecture.
High Performance Computing
- High performance density with multiple CPUs in compact 2U, 6U, and 8U form factors.
- Support for the latest processor architectures from Intel.
- Delivers numerous efficient cores for demanding workloads.
Cost-Optimized Design
- Liquid cooling reduces server cooling component electricity costs by up to 89%.
- Multi-node/blade configurations per rack offer significant space savings.
- Shared infrastructure optimizes cooling, power, and space for better TCO over time.
Future-Proof Design with High Scalability
- Flexible rear and front I/O options; supports high-performance GPUs.
- SuperBlade offers reusable enclosures, switches, midplanes, power supplies, and fans for next-gen blades.
Highest Density Multi-Node Server
SuperBlade® (Air-Cooled/Liquid-Cooled)
Purpose-Built Liquid-Cooled HPC at Rack Scale Solution
FlexTwin™ (Liquid-Cooled)
Industry-Leading Multi-Node Architectures
BigTwin® (Air-Cooled/Liquid-Cooled)
Multi-Node Architecture Optimized for Single-Processor Performance
GrandTwin® (Air-Cooled)
Supermicro Multi-Node TECHTalk Series
TECHTalk: GrandTwin® Multi-Node Systems
