X13DEM

X13DEM
X13 DP Hyper Server Board

Key Features


  1. 5th/4th Gen Intel® Xeon® Scalable processors and Intel® Xeon® Max series processors, Dual Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP
  2. Supports HBM and CXL
  3. Intel C741® Chipset
  4. Up to 8TB 3DS ECC RDIMM, DDR5-5600MT/s in 32 DIMM slots
  5. 4 PCIe 5.0 x16
  6. 2 AIOM OCP 3.0 superset
  7. 8 NVMe ports PCIe 5.0 x8 via 8 MCIO connectors
  8. 2 M.2
  9. 1 VGA
  10. 2 USB 2.0 and 2 USB 3.0
...
...

Optimized Servers


SYS-221HE-FTNR SYS-221HE-FTNRD SYS-121H-TNR SYS-621H-TN12R SYS-221H-TNR SYS-221H-TN24R SYS-221HE-TNR SYS-221HE-TNRD
Specifications Resources Parts List
Specifications
Product SKUs
MBD-X13DEM
Physical Stats
Form Factor
  • Proprietary
Dimension
  • 11.5" x 17" (29.21cm x 43.18cm)
Processor
CPU
Core Count
  • Up to 64C
Note
  • Supports up to 350W TDP CPUs
System Memory
Memory
  • Slot Count: 32 DIMM Slots
  • Max Memory (1DPC): Up to 2TB 5600MT/s ECC DDR5 RDIMM
  • Max Memory (2DPC): Up to 4TB 4400MT/s ECC DDR5 RDIMM
  • Max Memory (2DPC): Up to 8TB 5600MT/s ECC DDR5 3DS RDIMM
DIMM Sizes
  • RDIMM:16GB, 24GB, 32GB, 48GB, 64GB, 96GB, 128GB
  • 3DS RDIMM:128GB, 256GB
Memory Voltage
  • 1.1V
Error Detection
  • Corrects single-bit errors
  • Detects double-bit errors (using ECC memory)
On-Board Devices
Chipset
  • Intel® C741
SATA
  • SATA (6Gbps) via Intel® C741
Input / Output
USB
  • 1 USB 3.2 Gen1x1 port(s) (Header)
Video
  • 1 VGA port(s)
  • 1 Aspeed AST2600 BMC port(s)
TPM
  • 1 TPM header
Others
  • 8 MCIO port(s)
Expansion Slots
PCI-Express (PCIe) Configuration
  • 4 PCIe 5.0 x16 (in x16) slots
  • 2 PCIe 5.0 x16 AIOM slots , AIOM slots Superset of OCP 3.0 Expansion
M2
  • 2 M.2 PCIe 3.0 x2 slots (M-key 2280/22110)
System BIOS
BIOS Type
  • AMI 64MB UEFI
BIOS Features
  • Plug and Play (PnP)
  • ACPI 6.4
  • PCI FW 3.2
  • SMBIOS 2.8/3.5
  • UEFI 2.8A
Management
Software
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
PC Health Monitoring
Voltage
  • +12V
  • +3.3V
  • +5V
  • +5V standby
  • 5 -fan status
  • Chassis intrusion header
  • Chipset voltage
  • Memory Voltages
  • Monitors CPU voltages
  • Supports system management utility
  • System level control
  • VBAT
LED
  • CPU/system overheat LED
  • UID/remote UID LED
Temperature
  • CPU thermal trip support
  • Monitoring for CPU and chassis environment
  • PECI
  • Thermal monitor 2 (TM2) support
FAN
  • 8x 6-pin fan headers (up to 8 fans)
  • 5 fans with tachometer status monitoring
  • Fan speed control
  • Overheat LED indication
Other Features
  • ACPI power management
  • Chassis intrusion detection
  • Control of power-on for recovery from AC power loss
  • M.2 NGFF connector
  • Node manager support
  • UID
Operating Environment
Environmental Spec.
  • Operating Temperature: 10°C to 35°C (50°F to 95°F )
  • Non-operating Temperature: -40°C to 70°C (-40°F to 158°F)
  • Operating Relative Humidity: 8% to 90% (non-condensing)
  • Non-operating Relative Humidity: 5% to 95% (non-condensing)
Resources
Servers (Optimized for X13DEM)
SYS-221HE-FTNR
SYS-221HE-FTNRD
SYS-121H-TNR
SYS-621H-TN12R
SYS-221H-TNR
SYS-221H-TN24R
SYS-221HE-TNR
SYS-221HE-TNRD
...
Component Options
CPU List
Tested AOC List
Tested HDD / SSD List
Tested M.2 List
Tested Memory List
Software
BMC Firmware
Download Driver CD
Download the Latest Drivers and Utilities
OS Compatibility
Update Your BIOS
Documentation
Motherboard Manual
Quick Reference Guide
Parts List
Standard Parts (Retail Package)
Part Number Qty Description
CPU carrier SKT-1333L-0000-FXC 2 CPU carrier for 4th Gen Intel® Xeon® Scalable processors (XCC)
SKT-1424L-001B-LTS 2 CPU carrier for 4th Gen Intel® Xeon® Scalable processors (MCC)
SKT-1425H-001C-FXC 2 CPU carrier for 4th Gen Intel® Xeon® Scalable processors Max Series (HBM)
Optional Parts
Part Number Qty Description
TPM security module (optional, not included) AOM-TPM-9672V 1 SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor

X13DEM

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