X13DSF-A

X13DSF-A
X13 DP Storage Server Board

Key Features


  1. 5th/4th Gen Intel® Xeon® Scalable processors, Dual Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP
  2. Supports CXL
  3. Intel C741® Chipset
  4. Up to 8TB 3DS ECC RDIMM, DDR5-5600MT/s in 32 DIMM slots
  5. 2 GenZ x16 slot PCIe 5.0
  6. 2 AIOM connectors PCIe 5.0 x16
  7. 2 M.2
  8. 24 NVMe ports PCIe 5.0 x4 via 12 MCIO connectors
  9. 2 USB 3.0
  10. 4 SATA via SlimSAS
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Optimized Servers


SSG-121E-NES24R SSG-121E-NE316R SSG-221E-NE324R SSG-121E-NE3X12R
Specifications Resources Parts List
Specifications
Product SKUs
MBD-X13DSF-A
Physical Stats
Form Factor
  • Proprietary
Dimension
  • 17" x 13.64" (43.18cm x 34.65cm)
Processor
CPU
Core Count
  • Up to 64C
Note
  • Supports up to 350W TDP CPUs
System Memory
Memory
  • Slot Count: 32 DIMM Slots
  • Max Memory (2DPC): Up to 8TB 5600MT/s ECC DDR5 RDIMM/LRDIMM
DIMM Sizes
  • RDIMM:16GB, 24GB, 48GB, 96GB, 128GB, 256GB
Memory Voltage
  • 1.1V
Error Detection
  • Corrects single-bit errors
  • Detects double-bit errors (using ECC memory)
On-Board Devices
SATA
  • SATA (6Gbps) via Intel® C741; RAID 0/1/5/10 support ; Internal Port(s)
IPMI
  • ASPEED AST2600 BMC
Input / Output
USB
  • 2 USB 3 port(s) (Header)
TPM
  • 1 TPM header
Others
  • 12 MCIO port(s)
Expansion Slots
PCI-Express (PCIe) Configuration
  • 2 PCIe 5.0 x16 AIOM slots
  • 2 PCIe 5.0 x16 Right Riser slots
M2
  • 2 M.2 PCIe 3.0 x4 SATA slots (M-key 2280/22110)
System BIOS
BIOS Type
  • AMI 32MB UEFI
BIOS Features
  • Plug and Play (PnP)
  • PCI FW 3.2
  • ACPI 6.4
  • UEFI 2.8A
  • SMBIOS 2.8/3.5
Management
Software
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
PC Health Monitoring
LED
  • CPU/system overheat LED
  • UID/remote UID LED
Temperature
  • CPU thermal trip support
  • Monitoring for CPU and chassis environment
  • PECI
  • Thermal monitor 2 (TM2) support
FAN
  • 8x 4-pin fan headers (up to 8 fans)
  • 8 fans with tachometer monitoring
  • Fan speed control
  • Overheat LED indication
Other Features
  • +12V
  • +3.3V
  • +3.3V standby
  • +5V
  • +5V standby
  • ACPI power management
  • Chassis intrusion detection
  • Control of power-on for recovery from AC power loss
  • CPU temperature
  • CPU thermal trip support
  • M.2 NGFF connector
  • Memory temperature
  • Node manager support
  • PCH temperature
  • Peripheral temperature
  • Platform Environment Control Interface (PECI)/(TSI)
  • System temperature
  • UID
  • Veore
  • Vmem
Operating Environment
Environmental Spec.
  • Operating Temperature: 10°C to 35°C (50°F to 95°F )
  • Non-operating Temperature: -40°C to 70°C (-40°F to 158°F)
  • Operating Relative Humidity: 8% to 90% (non-condensing)
  • Non-operating Relative Humidity: 5% to 95% (non-condensing)
Resources
Servers (Optimized for X13DSF-A)
SSG-121E-NES24R
SSG-121E-NE316R
SSG-221E-NE324R
SSG-121E-NE3X12R
...
Component Options
CPU List
Tested AOC List
Tested HDD / SSD List
Tested M.2 List
Tested Memory List
Software
BMC Firmware
Download Driver CD
Download the Latest Drivers and Utilities
OS Compatibility
Update Your BIOS
Documentation
Motherboard Manual
Quick Reference Guide
Parts List
Optional Parts
Part Number Qty Description
CPU carrier SKT-1333L-0000-FXC 2 CPU carrier for 4th Gen Intel® Xeon® Scalable processors (XCC)
SKT-1424L-001B-FXC 2 CPU carrier for 4th Gen Intel® Xeon® Scalable processors (MCC)
TPM security module (optional, not included) AOM-TPM-9670V 1 SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor

X13DSF-A

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