X13SET-G

X13SET-G
X13 UP GrandTwin Server Board

Key Features


  1. 5th/4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP
  2. Intel C741® Chipset
  3. Up to 4TB 3DS ECC RDIMM, DDR5-5600MT/s (1DPC) or DDR5-4400MT/s (2DPC) in 16 DIMM slots
  4. 1 PCIe 5.0 x8 via customized 124-pin slim cool edge connector(for front I/O module)
  5. 2 PCIe 5.0 x16 via Molex Impleplus connectors
  6. 4 PCIe 5.0 X8 via MCIO connectors
  7. I/O: 1 COM, TPM header
  8. M.2 Interface: 2 PCIe 3.0x4&SATAM.2 Form Factor: 2280M.2 Key: M-Key
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Optimized Servers


SYS-211GT-HNTF SYS-211GT-HNTR
Specifications Resources Parts List
Specifications
Product SKUs
MBD-X13SET-G
Physical Stats
Form Factor
  • Proprietary GrandTwin
Dimension
  • 8.53" x 12.42" (21.67cm x 31.55cm)
Processor
CPU
Core Count
  • Up to 64C
Note
  • Supports up to 350W TDP CPUs
System Memory
Memory
  • Slot Count: 16 DIMM Slots
  • Max Memory (1DPC): Up to 2TB 5600MT/s ECC DDR5 RDIMM/3DS RDIMM
  • Max Memory (2DPC): Up to 4TB 4400MT/s ECC DDR5 RDIMM/3DS RDIMM
DIMM Sizes
  • RDIMM:16GB, 24GB, 32GB, 48GB, 64GB, 96GB
  • 3DS RDIMM:128GB, 256GB
Memory Voltage
  • 1.1V
Error Detection
  • Corrects single-bit errors
  • Detects double-bit errors (using ECC memory)
On-Board Devices
Chipset
  • Intel® C741
SATA
  • SATA (6Gbps) via Intel® C741; RAID 0/1/5/10 support ; via SlimSAS
IPMI
  • ASPEED AST2600 BMC
Network Controller
  • AIOM for LAN
Input / Output
Serial
  • 1 COM port(s) (header)
TPM
  • 1 TPM header
Expansion Slots
M2
  • 2 M.2 PCIe 3.0 x4 SATA slots (M-key 2280)
System BIOS
BIOS Type
  • AMI UEFI
BIOS Features
  • ACPI 6.4
  • SMBIOS 3.5
  • UEFI 2.8 or above
Management
Software
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
PC Health Monitoring
Voltage
  • +12V
  • +3.3V
  • +5V
  • +5V standby
  • Chipset voltage
  • Monitors CPU voltages
  • Supports system management utility
  • System level control
  • VBAT
LED
  • CPU/system overheat LED
  • UID/remote UID LED
Temperature
  • CPU thermal trip support
  • Monitoring for CPU and chassis environment
  • PECI
  • Thermal monitor 2 (TM2) support
FAN
  • 1x 4-pin fan header (up to 1 fan)
  • Fan speed control
Other Features
  • ACPI power management
  • Control of power-on for recovery from AC power loss
  • M.2 NGFF connector
  • Node manager support
  • UID
  • WOL
Operating Environment
Environmental Spec.
  • Operating Temperature: 0°C to 50°C (32°F to 122°F )
  • Non-operating Temperature: -30°C to 60°C (-22°F to 140°F)
  • Operating Relative Humidity: 8% to 80% (non-condensing)
  • Non-operating Relative Humidity: 8% to 90% (non-condensing)
Resources
Servers (Optimized for X13SET-G)
SYS-211GT-HNTF
SYS-211GT-HNTR
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Component Options
CPU List
Tested AOC List
Tested HDD / SSD List
Tested M.2 List
Tested Memory List
Software
BMC Firmware
Download Driver CD
Download the Latest Drivers and Utilities
OS Compatibility
Update Your BIOS
Documentation
Motherboard Manual
Quick Reference Guide
Parts List
Optional Parts
Part Number Qty Description
TPM security module AOM-TPM-9670V 1 SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor

X13SET-G

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